Inventor · disambiguated record
Tomota Nagaura
Also filed as: NAGAURA TOMOTA
9 granted patents·5 pending applications·21 citations·filing 2012–2019
83Inventor score
Top patents by PatentIndex Score
14 records- 0188US10123433B2Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2016·Granted Nov 6, 2018·9 cites·24 claims
- 0283US9578741B2Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2013·Granted Feb 21, 2017·4 cites·17 claims
- 0381US10332756B2Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2016·Granted Jun 25, 2019·4 cites·17 claims
- 0477US9788423B2Copper foil with carrierJX NIPPON MINING & METALS CORP·Filed 2016·Granted Oct 10, 2017·1 cites·1 claims
- 0576US10201092B2Carrier-attached copper foil, laminate, printed-wiring board and method for manufacturing the printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2014·Granted Feb 5, 2019·1 cites·21 claims
- 0675US10187983B2Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2016·Granted Jan 22, 2019·2 cites·23 claims
- 0768US2020095699A1Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatusJX NIPPON MINING & METALS CORP·Filed 2019·Application pending·0 cites
- 0867US10519558B2Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatusJX NIPPON MINING & METALS CORP·Filed 2018·Granted Dec 31, 2019·0 cites·9 claims
- 0961US9826635B2Carrier-attached copper foilJX NIPPON MINING & METALS CORP·Filed 2014·Granted Nov 21, 2017·0 cites·27 claims
- 1055US8980414B2Carrier-attached copper foilNAGAURA TOMOTA·Filed 2012·Granted Mar 17, 2015·0 cites·23 claims
- 1144US2016381805A1Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devicesJX NIPPON MINING & METALS CORP·Filed 2016·Application pending·0 cites
- 1241US2016374205A1Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devicesJX NIPPON MINING & METALS CORP·Filed 2016·Application pending·0 cites
- 1336US2016381806A1Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devicesJX NIPPON MINING & METALS CORP·Filed 2016·Application pending·0 cites
- 1435US2018282891A1Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatusJX NIPPON MINING & METALS CORP·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →