Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus

Abstract

Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.

What is claimed is: 
     
         1 . A plating solution comprising a Fe with a concentration of 0.018 ppm by mass or less. 
     
     
         2 . The plating solution according to  claim 1 , wherein the plating solution further comprises any one, any two, any three, any four, or five of the following items (8-1) to (8-5):
 (8-1) an In with a concentration of 0.2 ppm by mass or less,   (8-2) a Tl with a concentration of 0.01 ppm by mass or less,   (8-3) a Sn with a concentration of 0.3 ppm by mass or less,   (8-4) an Ag with a concentration of 0.4 ppm by mass or less, and   (8-5) an Al with concentration of 0.04 ppm by mass or less.   
     
     
         3 . The plating solution according to  claim 1 , wherein the plating solution further comprises any one, any two, any three, any four, or five of the following items (10-1) to (10-5):
 (10-1) an In with a concentration of 0.08 ppm by mass or less,   (10-2) a Tl with a concentration of 0.01 ppm by mass or less,   (10-3) a Sn with a concentration of 0.1 ppm by mass or less,   (10-4) an Ag with a concentration of 0.2 ppm by mass or less, and   (10-5) an Al with a concentration of 0.013 ppm by mass or less.   
     
     
         4 . The plating solution according to  claim 1 , wherein the plating solution has a copper concentration of from 50 to 100 g/L. 
     
     
         5 . The plating solution according to  claim 1 , wherein the plating solution has a copper concentration of from 50 to 90 g/L. 
     
     
         6 . A method for producing a semiconductor circuit board comprising performing copper plating by using the plating solution according to  claim 1 . 
     
     
         7 . A method for producing an electronic apparatus comprising producing an electronic apparatus by using a semiconductor circuit board produced by the method for producing a semiconductor circuit board according to  claim 6 .