Inventor · disambiguated record
Hueng Jae Oh
Also filed as: OH HUENG JAE
8 granted patents·3 pending applications·16 citations·filing 2008–2014
79Inventor score
Top patents by PatentIndex Score
11 records- 0180US7893355B2Lead pin for package boardsSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 22, 2011·10 cites·5 claims
- 0265US8708215B2Solder ball supplying apparatusSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 29, 2014·1 cites·5 claims
- 0361US8671564B2Substrate for flip chip bonding and method of fabricating the sameOH HUENG JAE·Filed 2009·Granted Mar 18, 2014·3 cites·8 claims
- 0460US8486760B2Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the sameCHUNG TAE JOON·Filed 2010·Granted Jul 16, 2013·2 cites·11 claims
- 0552US9142499B2Lead pin for package substrateSAMSUNG ELECTRO MECH·Filed 2014·Granted Sep 22, 2015·0 cites·17 claims
- 0651US8651356B2Solder bump forming apparatus and soldering facility including the sameSAMSUNG ELECTRO MECH·Filed 2012·Granted Feb 18, 2014·0 cites·15 claims
- 0749US2014138821A1Substrate for flip chip bonding and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0846US2010271792A1Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0944US2013134207A1Solder bump forming apparatus and soldering facility including the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1038US8766450B2Lead pin for package substrateLEE KI TAEK·Filed 2010·Granted Jul 1, 2014·0 cites·13 claims
- 1137US8785789B2Printed circuit board and method for manufacturing the sameOH HUENG JAE·Filed 2012·Granted Jul 22, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →