Inventor · disambiguated record
Brett H. Engel
Also filed as: ENGEL BRETT H
20 granted patents·11 pending applications·851 citations·filing 2001–2018
95Inventor score
Top patents by PatentIndex Score
31 records- 0197US6734090B2Method of making an edge seal for a semiconductor deviceIBM·Filed 2002·Granted May 11, 2004·605 cites·9 claims
- 0292US9224675B1Automatic capacitance tuning for robust middle of the line contact and silicide applicationsIBM·Filed 2014·Granted Dec 29, 2015·18 cites·20 claims
- 0389US7098676B2Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitorIBM·Filed 2003·Granted Aug 29, 2006·49 cites·12 claims
- 0484US8940634B2Overlapping contacts for semiconductor deviceENGEL BRETT H·Filed 2011·Granted Jan 27, 2015·8 cites·12 claims
- 0582US9000564B2Precision polysilicon resistorsST MICROELECTRONICS INC·Filed 2012·Granted Apr 7, 2015·6 cites·20 claims
- 0682US8435891B2Converting metal mask to metal-oxide etch stop layer and related semiconductor structureENGEL BRETT H·Filed 2011·Granted May 7, 2013·6 cites·17 claims
- 0782US6887783B2Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereofINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 3, 2005·26 cites·18 claims
- 0880US7163883B2Edge seal for a semiconductor deviceIBM·Filed 2003·Granted Jan 16, 2007·27 cites·6 claims
- 0975US10170359B2Diffusion barrier layer formationIBM·Filed 2017·Granted Jan 1, 2019·1 cites·11 claims
- 1075US6478212B1Bond pad structure and method for reduced downward force wirebondingIBM·Filed 2001·Granted Nov 12, 2002·22 cites·21 claims
- 1173US8580628B2Integrated circuit contact structure and methodLABONTE ANDRE P·Filed 2012·Granted Nov 12, 2013·4 cites·11 claims
- 1272US6831363B2Structure and method for reducing thermo-mechanical stress in stacked viasIBM·Filed 2002·Granted Dec 14, 2004·18 cites·15 claims
- 1371US9847251B2Diffusion barrier layer formationIBM·Filed 2016·Granted Dec 19, 2017·1 cites·7 claims
- 1471US6914320B2Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jul 5, 2005·13 cites·17 claims
- 1570US7008803B2Method of reworking structures incorporating low-k dielectric materialsIBM·Filed 2002·Granted Mar 7, 2006·14 cites·8 claims
- 1670US6539625B2Chromium adhesion layer for copper vias in low-k technologyIBM·Filed 2001·Granted Apr 1, 2003·17 cites·9 claims
- 1763US6472740B1Self-supporting air bridge interconnect structure for integrated circuitsIBM·Filed 2001·Granted Oct 29, 2002·11 cites·30 claims
- 1860US2018374746A1Diffusion barrier layer formationIBM·Filed 2018·Application pending·0 cites
- 1958US9406554B2Diffusion barrier layer formationIBM·Filed 2014·Granted Aug 2, 2016·0 cites·9 claims
- 2056US10319633B2Diffusion barrier layer formationIBM·Filed 2016·Granted Jun 11, 2019·0 cites·8 claims
- 2152US7397073B2Barrier dielectric stack for seam protectionIBM·Filed 2004·Granted Jul 8, 2008·5 cites·2 claims
- 2250US2017271471A1NiPt AND Ti INTERSECTING SILICIDE PROCESS AND STRUCTUREIBM·Filed 2017·Application pending·0 cites
- 2349US2013241070A1Overlapping contacts for semiconductor deviceIBM·Filed 2013·Application pending·0 cites
- 2449US2008227247A1Barrier dielectric stack for seam protectionIBM·Filed 2008·Application pending·0 cites
- 2548US2017194454A1NiPt AND Ti INTERSECTING SILICIDE PROCESS AND STRUCTUREIBM·Filed 2016·Application pending·0 cites
- 2646US2006014376A1Stacked via-stud with improved reliability in copper metallurgyIBM·Filed 2005·Application pending·0 cites
- 2743US2005285106A1Method of reworking structures incorporating low-k dielectric materialsIBM·Filed 2005·Application pending·0 cites
- 2841US2014183720A1Methods of manufacturing integrated circuits having a compressive nitride layerGLOBALFOUNDRIES INC·Filed 2012·Application pending·0 cites
- 2940US2003134499A1Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereofIBM·Filed 2002·Application pending·0 cites
- 3036US2002132471A1High modulus film structure for enhanced electromigration resistanceIBM·Filed 2001·Application pending·0 cites
- 3135US2007099433A1Gas dielectric structure formation using radiationIBM·Filed 2005·Application pending·0 cites
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