Inventor · disambiguated record
Man-Zhi Peng
Also filed as: PENG MAN-ZHI
12 granted patents·2 pending applications·6 citations·filing 2018–2023
82Inventor score
Files withQING DING PREC ELECTRONICS HUAIAN CO LTD8AVARY HOLDING SHENZHEN CO LTD5HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD1
Top patents by PatentIndex Score
14 records- 0186US10863620B1Bendable circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Dec 8, 2020·2 cites·10 claims
- 0276US11483938B2Method for connecting stacked circuit boardsAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Oct 25, 2022·2 cites·11 claims
- 0375US10910300B1Method for manufacturing interposerQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted Feb 2, 2021·2 cites·12 claims
- 0469US11510319B2Connecting structureQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·10 claims
- 0567US11252818B2Printed circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·9 claims
- 0664US11665820B2Adapter board and method for making adapter boardQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2021·Granted May 30, 2023·0 cites·7 claims
- 0760US10849229B2Printed circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·11 claims
- 0857US2024203899A1System-in-package module and method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2023·Application pending·0 cites
- 0954US11296444B2Edge-to-edge board connection structureQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2020·Granted Apr 5, 2022·0 cites·11 claims
- 1052US2021235581A1Adapter board and method for making adaptor boardQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Application pending·0 cites
- 1151US11917278B2Camera module of reduced size and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·16 claims
- 1250US11310922B2Board-to-board connecting structure and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·14 claims
- 1349US11051404B2Method for connecting stacked circuits boardsQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted Jun 29, 2021·0 cites·10 claims
- 1442US12308252B2Interposer, manufacturing method therefor, and circuit board assemblyQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted May 20, 2025·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →