Adapter board and method for making adaptor board

Abstract

Disclosure provides an adaptor board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

What is claimed is: 
     
         1 . An adaptor board, characterized in that the adaptor board comprises a board body and a plurality of wires provided in the board body, and the board body comprises a first surface and a second surface arranged opposite the first surface; the first surface is provided with a plurality of first connection pads, and the second surface is, provided with a plurality of second connection pads; each of the first connection pads is connected to one of the second connection pads through a said one of the wires; the first connection pads have a first span, the plurality of second connection pads have a second span, and the first span is not equal to the second span. 
     
     
         2 . The adapter board according to  claim 1 , wherein the plurality of wires have a third span, the third span is greater than the first span of two connected first connection pads, and smaller than the second span of two connected second connection pads. 
     
     
         3 . The adaptor board according to  claim 2 , wherein the third span becomes smaller and smaller as the wires extend from the second connection pads to the first connection pads. 
     
     
         4 . The adapter board according to  claim 1 , wherein a cross-sectional area of the wires is smaller than a cross-sectional area of the first connection pads and the second connection pads. 
     
     
         5 . The adapter board according to  claim 1 , wherein the area of the first surface is smaller than the area of the second surface, and the projection of the first surface on the plane of the second surface falls completely inside the second surface. 
     
     
         6 . The adapter board according to  claim 1 , wherein the material of the board body is one of Poly Ether Ether Ketone, Poly Tetra Fluoro Ethylene, Poly Phenylene Sulfone Resins, Liquid Crystal Polymer, Poly Phenylene Sulfide, Polytetrafluoro ethylene, and ceramic powder. 
     
     
         7 . The adapter board according to  claim 1 , wherein the material of the wires is one of copper, aluminum, silver, gold, copper alloys, and aluminum alloys. 
     
     
         8 . A method for making an adapter board, which includes the following steps:
 providing a mold, in which a plurality of first fixing plates and second fixing plates are provided alternately at intervals, the first fixing plate is provided with a plurality of first fixing holes, and the second fixing plate is provided with a plurality of second fixing holes;   providing a plurality of wires, and passing the plurality of wires through the first fixing plate and the second fixing plate in sequence through the first fixing holes and the second fixing holes;   injecting a non-conductive material into the mold to form a body;   cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies, the board bodies comprising oppositely arranged first surfaces and second surfaces;   forming a plurality of first connection pads on the first surface and a plurality of second connection pads on the second surface, each of the first connection pads connected to one of the second connection pads through a wire.   
     
     
         9 . The method for making an adaptor board according to  claim 8 , wherein the distance between the centerlines of two adjacent first fixing holes is smaller than the distance between the centerlines of two adjacent second fixing holes. 
     
     
         10 . The method for making an adapter board according to  claim 8 , wherein after forming the plurality of first connection pads on the first surface and forming the plurality of second connection pads on the second surface, the method includes the steps of: cutting the board body along outermost first and second connection pads.