Inventor · disambiguated record
Wen-Jeng Fan
Also filed as: FAN WEN · FAN WEN-JENG
42 granted patents·40 pending applications·425 citations·filing 2006–2019
97Inventor score
Files withPOWERTECH TECHNOLOGY INC69FAN WEN-JENG9POWERTECH TECHNOLOGY CORP2AMAZON TECH INC1POWERTCH TECHNOLOGY INC1
Top patents by PatentIndex Score
82 records- 0199US7569935B1Pillar-to-pillar flip-chip assemblyPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Aug 4, 2009·163 cites·16 claims
- 0296US8420437B1Method for forming an EMI shielding layer on all surfaces of a semiconductor packageFAN WEN-JENG·Filed 2011·Granted Apr 16, 2013·40 cites·12 claims
- 0394US7776649B1Method for fabricating wafer level chip scale packagesPOWERTECH TECHNOLOGY INC·Filed 2009·Granted Aug 17, 2010·36 cites·12 claims
- 0494US7633143B1Semiconductor package having plural chips side by side arranged on a leadframePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Dec 15, 2009·30 cites·14 claims
- 0591US9853015B1Semiconductor device with stacking chipsPOWERTECH TECHNOLOGY INC·Filed 2016·Granted Dec 26, 2017·8 cites·11 claims
- 0690US10593629B2Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Mar 17, 2020·9 cites·20 claims
- 0790US7619305B2Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stackingPOWERTECH TECHNOLOGY INC·Filed 2007·Granted Nov 17, 2009·31 cites·24 claims
- 0885US11386152B1Automatic generation of highlight clips for eventsAMAZON TECH INC·Filed 2018·Granted Jul 12, 2022·13 cites·17 claims
- 0982US7667306B1Leadframe-based semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Feb 23, 2010·10 cites·14 claims
- 1078US7927919B1Semiconductor packaging method to save interposerPOWERTECH TECHNOLOGY INC·Filed 2009·Granted Apr 19, 2011·11 cites·15 claims
- 1178US7902663B2Semiconductor package having stepwise depression in substratePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Mar 8, 2011·8 cites·11 claims
- 1275US7692313B2Substrate and semiconductor package for lessening warpagePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·6 cites·16 claims
- 1375US7622794B1COL (Chip-On-Lead) multi-chip packagePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Nov 24, 2009·6 cites·18 claims
- 1474US9859233B1Semiconductor device package with reinforced redistribution layerPOWERTECH TECHNOLOGY INC·Filed 2016·Granted Jan 2, 2018·2 cites·16 claims
- 1573US7692311B2POP (package-on-package) device encapsulating soldered joints between external leadsPOWERTECH TECHNOLOGY INC·Filed 2007·Granted Apr 6, 2010·6 cites·9 claims
- 1673US7675186B2IC package with a protective encapsulant and a stiffening encapsulantPOWERTECH TECHNOLOGY INC·Filed 2006·Granted Mar 9, 2010·6 cites·7 claims
- 1772US10431549B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Oct 1, 2019·2 cites·9 claims
- 1872US7696618B2POP (package-on-package) semiconductor devicePOWERTECH TECHNOLOGY INC·Filed 2007·Granted Apr 13, 2010·5 cites·13 claims
- 1970US7919715B2Circuit board ready to slotPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Apr 5, 2011·4 cites·10 claims
- 2070US7919851B2Laminate substrate and semiconductor package utilizing the substratePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Apr 5, 2011·4 cites·20 claims
- 2168US9837385B1Substrate-less package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Dec 5, 2017·1 cites·13 claims
- 2266US7691676B1Mold array process for semiconductor packagesPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·3 cites·11 claims
- 2366US7605018B2Method for forming a die-attach layer during semiconductor packaging processesPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Oct 20, 2009·3 cites·7 claims
- 2463US9324651B1Package structurePOWERTECH TECHNOLOGY INC·Filed 2014·Granted Apr 26, 2016·1 cites·14 claims
- 2563US7479704B2Substrate improving immobilization of ball pads for BGA packagesPOWERTECH TECHNOLOGY INC·Filed 2007·Granted Jan 20, 2009·2 cites·11 claims
- 2662US8304917B2Multi-chip stacked package and its mother chip to save interposerFAN WEN-JENG·Filed 2009·Granted Nov 6, 2012·4 cites·12 claims
- 2762US7732921B2Window type BGA semiconductor package and its substratePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Jun 8, 2010·4 cites·15 claims
- 2860US8853834B2Leadframe-type semiconductor package having EMI shielding layer connected to groundPOWERTECH TECHNOLOGY INC·Filed 2012·Granted Oct 7, 2014·1 cites·13 claims
- 2960US8299587B2Lead frame package structure for side-by-side disposed chipsFAN WEN-JENG·Filed 2010·Granted Oct 30, 2012·1 cites·8 claims
- 3060US8049339B2Semiconductor package having isolated inner leadPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Nov 1, 2011·2 cites·16 claims
- 3159US7972904B2Wafer level packaging methodPOWERTECH TECHNOLOGY INC·Filed 2009·Granted Jul 5, 2011·1 cites·16 claims
- 3257US7750444B2Lead-on-chip semiconductor package and leadframe for the packagePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Jul 6, 2010·1 cites·20 claims
- 3356US7723828B2Semiconductor package with leads on a chip having multi-row of bonding padsPOWERTECH TECHNOLOGY INC·Filed 2008·Granted May 25, 2010·1 cites·8 claims
- 3452US8053676B2Substrate panel having a plurality of substrate strips for semiconductor packagesPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Nov 8, 2011·0 cites·14 claims
- 3549US7952168B2Substrate strip for semiconductor packagesPOWERTECH TECHNOLOGY INC·Filed 2008·Granted May 31, 2011·0 cites·20 claims
- 3649US7547974B2Wiring substrate with improvement in tensile strength of tracesPOWERTECH TECHNOLOGY INC·Filed 2006·Granted Jun 16, 2009·0 cites·15 claims
- 3746US7566963B2Stacked assembly of semiconductor packages with fastening lead-cut ends of leadframePOWERTECH TECHNOLOGY INC·Filed 2007·Granted Jul 28, 2009·0 cites·8 claims
- 3846US2009227048A1Method for die bonding having pick-and-probing featurePOWERTECH TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 3946US2010019373A1Universal substrate for semiconductor packages and the packagesPOWERTECH TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 4046US2016163624A1Package structurePOWERTECH TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 4145US7821112B2Semiconductor device with wire-bonding on multi-zigzag fingersPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·0 cites·20 claims
- 4245US2009039490A1Mounting assembly of semiconductor packages prevent soldering defects caused by substrate warpagePOWERTECH TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 4345US2009091027A1Semiconductor package having restraining ring surfaces against soldering crackPOWERTECH TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 4445US2009026599A1Memory module capable of lessening shock stressPOWERTECH TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 4545US2009091026A1Stackable semiconductor package having plural pillars per padPOWERTECH TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 4645US2009224412A1Non-planar substrate strip and semiconductor packaging method utilizing the substrate stripPOWERTECH TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 4745US2009137069A1Chip packaging process including simpification and mergence of burn-in test and high temperature testPOWERTECH TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 4844US8541870B1Semiconductor package utilizing tape to reinforce fixing of leads to die padPOWERTECH TECHNOLOGY INC·Filed 2012·Granted Sep 24, 2013·0 cites·10 claims
- 4944US8240029B2Method for forming an isolated inner lead from a leadframeFAN WEN-JENG·Filed 2008·Granted Aug 14, 2012·0 cites·20 claims
- 5044US2008157334A1Memory module for improving impact resistancePOWERTECH TECHNOLOGY INC·Filed 2006·Application pending·0 cites
Showing the top 50 of 82 patent records by PatentIndex Score.
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