Assignee
FAN WEN-JENG
TW·4 granted patents·5 pending applications·45 citations·filing 2008–2011
Top patents by PatentIndex Score
9 records- 0196US8420437B1Method for forming an EMI shielding layer on all surfaces of a semiconductor packageFAN WEN-JENG·Filed 2011·Granted Apr 16, 2013·40 cites·12 claims
- 0262US8304917B2Multi-chip stacked package and its mother chip to save interposerFAN WEN-JENG·Filed 2009·Granted Nov 6, 2012·4 cites·12 claims
- 0360US8299587B2Lead frame package structure for side-by-side disposed chipsFAN WEN-JENG·Filed 2010·Granted Oct 30, 2012·1 cites·8 claims
- 0444US8240029B2Method for forming an isolated inner lead from a leadframeFAN WEN-JENG·Filed 2008·Granted Aug 14, 2012·0 cites·20 claims
- 0544US2009160041A1Substrate package structureFAN WEN-JENG·Filed 2008·Application pending·0 cites
- 0638US2012228759A1Semiconductor package having interconnection of dual parallel wiresFAN WEN-JENG·Filed 2011·Application pending·0 cites
- 0737US2010147565A1Window ball grid array substrate and its package structureFAN WEN-JENG·Filed 2008·Application pending·0 cites
- 0837US2012049359A1Ball grid array packageFAN WEN-JENG·Filed 2010·Application pending·0 cites
- 0936US2011169157A1Substrate and flip chip package with gradational pad pitchesFAN WEN-JENG·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →