Method for die bonding having pick-and-probing feature

Abstract

Disclosed is a die-bonding method having pick-and-probe features after wafer sawing where at least a die is probed and sorted according to different grades during a pick-and-place step performed after wafer sawing. A suction nozzle having a plurality of probes is utilized to probe the electrical terminals of the die. After picking, the suction nozzle is moved on a common moving path and the picked die is tested through the suction nozzle. The picked-and-probed die is moved and die-bonded to a die carrier loaded in a corresponding one of a plurality of die-bonding areas by moving the Suction nozzle on a chosen sorting path. Therefore, the die is probed and sorted during die-bonding processes. Higher graded dice at a same level are assembled on a same die carrier to form a higher graded semiconductor package.

1 . A die-bonding method with pick-and-probe features after wafer sawing, primarily comprising the steps of:
 providing at least a die having a plurality of electrical terminals, wherein the die is loaded in a loading area;   providing a plurality of die carriers loaded in a plurality of die-bonding areas, wherein the die-bonding areas are sorted for different graded dice; and   performing a pick-and-place step by utilizing at least a suction nozzle having a plurality of probes, wherein the pick-and-place step includes:
 picking up the die in the loading area wherein the probes probe the electrical terminals of the die at the same time; 
 testing the picked up die for evaluating its grades and moving the suction nozzle on a common moving path from the loading area toward the die-bonding areas; 
 choosing a corresponding one of a plurality of sorting paths according to the grade of the die, wherein the sorting paths connect the common moving path to the die-bonding areas respectively; 
 moving the suction nozzle to the corresponding one of the die-bonding areas; and 
 bonding the die picked by the suction nozzle to the corresponding die carrier in the corresponding die-bonding area. 
   
   
   
       2 . The method as claimed in  claim 1 , wherein the step of testing the picked up die is completed and merged during the suction nozzle is moving on the common moving path. 
   
   
       3 . The method as claimed in  claim 1 , wherein the die carrier is a substrate. 
   
   
       4 . The method as claimed in  claim 1 , wherein the die carrier is a semiconductor die. 
   
   
       5 . The method as claimed in  claim 1 , wherein the suction nozzle has a vacuum hole and is in contact with an active surface of the die when picking. 
   
   
       6 . The method as claimed in  claim 5 , wherein the plurality of probes are formed in the vacuum hole of the suction nozzle. 
   
   
       7 . The method as claimed in  claim 1 , wherein the die in the loading area is attached to a wafer saw tape.