Inventor · disambiguated record
Grant Villavicencio
Also filed as: VILLAVICENCIO GRANT · VILLAVICENCIO GRANT SALES
11 granted patents·2 pending applications·76 citations·filing 2008–2018
87Inventor score
Top patents by PatentIndex Score
13 records- 0194US7923349B2Wafer level surface passivation of stackable integrated circuit chipsVERTICAL CIRCUITS INC·Filed 2008·Granted Apr 12, 2011·37 cites·25 claims
- 0292US7863159B2Semiconductor die separation methodVERTICAL CIRCUITS INC·Filed 2008·Granted Jan 4, 2011·21 cites·24 claims
- 0381US8680687B2Electrical interconnect for die stacked in zig-zag configurationCO REYNALDO·Filed 2010·Granted Mar 25, 2014·7 cites·31 claims
- 0476US9153517B2Electrical connector between die pad and z-interconnect for stacked die assembliesCO REYNALDO·Filed 2011·Granted Oct 6, 2015·5 cites·19 claims
- 0571US9508689B2Electrical connector between die pad and z-interconnect for stacked die assembliesINVENSAS CORP·Filed 2015·Granted Nov 29, 2016·2 cites·18 claims
- 0668US8884403B2Semiconductor die array structureCO REYNALDO·Filed 2010·Granted Nov 11, 2014·2 cites·8 claims
- 0767US8324081B2Wafer level surface passivation of stackable integrated circuit chipsMCELREA SIMON J S·Filed 2011·Granted Dec 4, 2012·2 cites·9 claims
- 0853US10806036B2Pressing of wire bond wire tips to provide bent-over tipsINVENSAS CORP·Filed 2018·Granted Oct 13, 2020·0 cites·5 claims
- 0950US2015056753A1Semiconductor Die Having Fine Pitch Electrical InterconnectsINVENSAS CORP·Filed 2014·Application pending·0 cites
- 1048US9888579B2Pressing of wire bond wire tips to provide bent-over tipsINVENSAS CORP·Filed 2015·Granted Feb 6, 2018·0 cites·9 claims
- 1141US8829677B2Semiconductor die having fine pitch electrical interconnectsBARRIE KEITH LAKE·Filed 2011·Granted Sep 9, 2014·0 cites·37 claims
- 1236US9659848B1Stiffened wires for offset BVAINVENSAS CORP·Filed 2016·Granted May 23, 2017·0 cites·21 claims
- 1332US2021134566A1Substrate mountSEMBLANT LTD·Filed 2018·Application pending·0 cites
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