Inventor · disambiguated record
Antti Iihola
Also filed as: IIHOLA ANTTI
35 granted patents·5 pending applications·241 citations·filing 2004–2024
97Inventor score
Files withTUOMINEN RISTO8GE EMBEDDED ELECTRONICS OY7IIHOLA ANTTI6MURATA MANUFACTURING CO6IMBERATEK LLC5
Top patents by PatentIndex Score
40 records- 0198US9363898B2Method for manufacturing an electronic module and an electronic moduleTUOMINEN RISTO·Filed 2015·Granted Jun 7, 2016·35 cites·14 claims
- 0298US8704359B2Method for manufacturing an electronic module and an electronic moduleTUOMINEN RISTO·Filed 2011·Granted Apr 22, 2014·43 cites·22 claims
- 0392US8062537B2Method for manufacturing an electronics moduleTUOMINEN RISTO·Filed 2005·Granted Nov 22, 2011·28 cites·11 claims
- 0490US8581109B2Method for manufacturing a circuit board structureTUOMINEN RISTO·Filed 2006·Granted Nov 12, 2013·14 cites·19 claims
- 0589US7719851B2Electronics module and method for manufacturing the sameIMBERA ELECTRONICS OY·Filed 2005·Granted May 18, 2010·17 cites·8 claims
- 0685US10798823B2Method for manufacturing an electronic module and electronic moduleIMBERATEK LLC·Filed 2014·Granted Oct 6, 2020·5 cites·14 claims
- 0785US8455994B2Electronic module with feed through conductor between wiring patternsIIHOLA ANTTI·Filed 2010·Granted Jun 4, 2013·8 cites·18 claims
- 0884US8240032B2Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layerIIHOLA ANTTI·Filed 2005·Granted Aug 14, 2012·13 cites·20 claims
- 0983US8699233B2Circuit module and method of manufacturing the samePALM PETTERI·Filed 2009·Granted Apr 15, 2014·8 cites·35 claims
- 1083US8238113B2Electronic module with vertical connector between conductor patternsIIHOLA ANTTI·Filed 2010·Granted Aug 7, 2012·7 cites·21 claims
- 1182US9691724B2Multi-chip package and manufacturing methodGE EMBEDDED ELECTRONICS OY·Filed 2014·Granted Jun 27, 2017·4 cites·21 claims
- 1282US7696005B2Method for manufacturing an electronic module in an installation baseIMBERA ELECTRONICS OY·Filed 2004·Granted Apr 13, 2010·25 cites·12 claims
- 1379US8240033B2Method for manufacturing a circuit boardTUOMINEN RISTO·Filed 2006·Granted Aug 14, 2012·8 cites·21 claims
- 1476US8735735B2Electronic module with embedded jumper conductorPALM PETTERI·Filed 2010·Granted May 27, 2014·4 cites·15 claims
- 1575US8547701B2Electronics module and method for manufacturing the sameTUOMINEN RISTO·Filed 2005·Granted Oct 1, 2013·7 cites·21 claims
- 1674US11792941B2Circuit board structure and method for manufacturing a circuit board structureIMBERATEK LLC·Filed 2021·Granted Oct 17, 2023·0 cites·17 claims
- 1773US11716816B2Method for manufacturing an electronic module and electronic moduleIMBERATEK LLC·Filed 2021·Granted Aug 1, 2023·0 cites·14 claims
- 1873US10085347B2Manufacture of a circuit board and circuit board containing a componentGE EMBEDDED ELECTRONICS OY·Filed 2015·Granted Sep 25, 2018·2 cites·8 claims
- 1973US9412934B2Microelectromechanical resonatorMURATA ELECTRONICS OY·Filed 2013·Granted Aug 9, 2016·5 cites·7 claims
- 2070US9883587B2Circuit module and method of manufacturing the samePALM PETTERI·Filed 2016·Granted Jan 30, 2018·1 cites·20 claims
- 2168US8225499B2Method for manufacturing a circuit board structure, and a circuit board structureTUOMINEN RISTO·Filed 2006·Granted Jul 24, 2012·3 cites·22 claims
- 2268US2020187358A1Method for manufacturing an electronic module and electronic moduleIMBERATEK LLC·Filed 2020·Application pending·0 cites
- 2367US9425158B2Rigid-flex module and manufacturing methodIIHOLA ANTTI·Filed 2010·Granted Aug 23, 2016·2 cites·10 claims
- 2467US9107324B2Circuit module and method of manufacturing the samePALM PETTERI·Filed 2014·Granted Aug 11, 2015·1 cites·20 claims
- 2566US9622354B2Method for manufacturing a circuit board structureGE EMBEDDED ELECTRONICS OY·Filed 2013·Granted Apr 11, 2017·1 cites·14 claims
- 2661US2024116753A1Method for sealing a mems device and a sealed mems deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 2756US11134572B2Circuit board structure and method for manufacturing a circuit board structureIMBERATEK LLC·Filed 2016·Granted Sep 28, 2021·0 cites·17 claims
- 2855US8659134B2Multi-chip package and manufacturing methodIIHOLA ANTTI·Filed 2009·Granted Feb 25, 2014·0 cites·19 claims
- 2955US2024343558A1Double layer mems devices and method of manufactureMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 3054US2014208588A1Method for manufacturing an electronic module and an electronic moduleTUOMINEN RISTO·Filed 2014·Application pending·0 cites
- 3153US10231335B2Electronic module with embedded jumper conductorGE EMBEDDED ELECTRONICS OY·Filed 2014·Granted Mar 12, 2019·0 cites·18 claims
- 3252US9820375B2Rigid-flex module and manufacturing methodGE EMBEDDED ELECTRONICS OY·Filed 2017·Granted Nov 14, 2017·0 cites·8 claims
- 3352US2017271288A1Multi-chip package and manufacturing methodGE EMBEDDED ELECTRONICS OY·Filed 2017·Application pending·0 cites
- 3450US9674948B2Rigid-flex electronic moduleGE EMBEDDED ELECTRONICS OY·Filed 2016·Granted Jun 6, 2017·0 cites·11 claims
- 3550US9334160B2Method of manufacturing a MEMS structureMURATA MANUFACTURING CO·Filed 2015·Granted May 10, 2016·0 cites·21 claims
- 3649US12043542B2MEMS structure including a cap with a viaMURATA MANUFACTURING CO·Filed 2020·Granted Jul 23, 2024·0 cites·10 claims
- 3749US9232658B2Method for manufacturing an electronic moduleIIHOLA ANTTI·Filed 2010·Granted Jan 5, 2016·0 cites·14 claims
- 3847US9764942B2Multi-level micromechanical structureMURATA MANUFACTURING CO·Filed 2016·Granted Sep 19, 2017·0 cites·6 claims
- 3946US8351214B2Electronics module comprising an embedded microcircuitIMBERA ELECTRONICS OY·Filed 2010·Granted Jan 8, 2013·0 cites·15 claims
- 4037US9969615B2Manufacturing method of a multi-level micromechanical structure on a single layer of homogenous materialMURATA MANUFACTURING CO·Filed 2016·Granted May 15, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →