Assignee
GE EMBEDDED ELECTRONICS OY
FI·9 granted patents·1 pending application·10 citations·filing 2013–2018
Top patents by PatentIndex Score
10 records- 0182US9691724B2Multi-chip package and manufacturing methodGE EMBEDDED ELECTRONICS OY·Filed 2014·Granted Jun 27, 2017·4 cites·21 claims
- 0273US10085347B2Manufacture of a circuit board and circuit board containing a componentGE EMBEDDED ELECTRONICS OY·Filed 2015·Granted Sep 25, 2018·2 cites·8 claims
- 0371US10085345B2Electronic moduleGE EMBEDDED ELECTRONICS OY·Filed 2014·Granted Sep 25, 2018·1 cites·17 claims
- 0468US9999136B2Method for fabrication of an electronic module and electronic moduleGE EMBEDDED ELECTRONICS OY·Filed 2014·Granted Jun 12, 2018·2 cites·20 claims
- 0566US9622354B2Method for manufacturing a circuit board structureGE EMBEDDED ELECTRONICS OY·Filed 2013·Granted Apr 11, 2017·1 cites·14 claims
- 0658US10470346B2Electronic module with EMI protectionGE EMBEDDED ELECTRONICS OY·Filed 2018·Granted Nov 5, 2019·0 cites·20 claims
- 0753US10231335B2Electronic module with embedded jumper conductorGE EMBEDDED ELECTRONICS OY·Filed 2014·Granted Mar 12, 2019·0 cites·18 claims
- 0852US9820375B2Rigid-flex module and manufacturing methodGE EMBEDDED ELECTRONICS OY·Filed 2017·Granted Nov 14, 2017·0 cites·8 claims
- 0952US2017271288A1Multi-chip package and manufacturing methodGE EMBEDDED ELECTRONICS OY·Filed 2017·Application pending·0 cites
- 1050US9674948B2Rigid-flex electronic moduleGE EMBEDDED ELECTRONICS OY·Filed 2016·Granted Jun 6, 2017·0 cites·11 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →