Inventor · disambiguated record
Son K. Tran
Also filed as: TRAN SON K · TRAN SON KIM
27 granted patents·5 pending applications·327 citations·filing 1997–2021
96Inventor score
Top patents by PatentIndex Score
32 records- 0185US7119003B2Extension of fatigue life for C4 solder ball to chip connectionIBM·Filed 2005·Granted Oct 10, 2006·14 cites·19 claims
- 0284US6074895AMethod of forming a flip chip assemblyIBM·Filed 1997·Granted Jun 13, 2000·63 cites·14 claims
- 0383US6739497B2SMT passive device noflow underfill methodology and structureIBM·Filed 2002·Granted May 25, 2004·31 cites·17 claims
- 0480US9627784B1Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2015·Granted Apr 18, 2017·2 cites·10 claims
- 0578US6100114AEncapsulation of solder bumps and solder connectionsIBM·Filed 1998·Granted Aug 8, 2000·54 cites·14 claims
- 0677US6617698B2Reworkable and thermally conductive adhesive and use thereofIBM·Filed 2001·Granted Sep 9, 2003·11 cites·8 claims
- 0775US6596559B2Flip-chip package with optimized encapsulant adhesion and methodIBM·Filed 2001·Granted Jul 22, 2003·17 cites·21 claims
- 0874US11810893B2Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protectionIBM·Filed 2021·Granted Nov 7, 2023·0 cites·1 claims
- 0974US11049841B2Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protectionIBM·Filed 2017·Granted Jun 29, 2021·1 cites·3 claims
- 1074US7408264B2SMT passive device noflow underfill methodology and structureIBM·Filed 2006·Granted Aug 5, 2008·5 cites·4 claims
- 1170US10014273B2Fixture to constrain laminate and method of assemblyIBM·Filed 2016·Granted Jul 3, 2018·1 cites·20 claims
- 1267US6246124B1Encapsulated chip module and method of making sameIBM·Filed 1998·Granted Jun 12, 2001·30 cites·10 claims
- 1366US10368441B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2018·Granted Jul 30, 2019·1 cites·20 claims
- 1466US6306683B1Method of forming a flip chip assembly, and a flip chip assembly formed by the methodIBM·Filed 2000·Granted Oct 23, 2001·16 cites·42 claims
- 1564US6021904AChip carrier processing and shipping array and method of manufacture thereofIBM·Filed 1999·Granted Feb 8, 2000·33 cites·24 claims
- 1661US7109592B2SMT passive device noflow underfill methodology and structureIBM·Filed 2004·Granted Sep 19, 2006·8 cites·1 claims
- 1760US2018350768A1Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and ProtectionIBM·Filed 2018·Application pending·0 cites
- 1859US9974179B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2017·Granted May 15, 2018·0 cites·6 claims
- 1958US6558981B2Method for making an encapsulated semiconductor chip moduleIBM·Filed 2001·Granted May 6, 2003·7 cites·8 claims
- 2058US6348738B1Flip chip assemblyIBM·Filed 1999·Granted Feb 19, 2002·17 cites·7 claims
- 2157US9455234B2Fixture to constrain laminate and method of assemblyIBM·Filed 2014·Granted Sep 27, 2016·0 cites·17 claims
- 2256US6777817B2Reworkable and thermally conductive adhesive and use thereofIBM·Filed 2003·Granted Aug 17, 2004·2 cites·15 claims
- 2356US6713858B2Flip-chip package with optimized encapsulant adhesion and methodIBM·Filed 2003·Granted Mar 30, 2004·5 cites·4 claims
- 2455US2016233190A1Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and ProtectionIBM·Filed 2016·Application pending·0 cites
- 2554US10750615B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 2650US2013082365A1Interposer for ESD, EMI, and EMCBERNIER WILLIAM E·Filed 2011·Application pending·0 cites
- 2749US8759151B2Fixture to constrain laminate and method of assemblyLOMBARDI THOMAS E·Filed 2012·Granted Jun 24, 2014·0 cites·14 claims
- 2848US2009085202A1Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si InterposerDANG BING·Filed 2007·Application pending·0 cites
- 2946US8188597B2Fixture to constrain laminate and method of assemblyLOMBARDI THOMAS E·Filed 2010·Granted May 29, 2012·0 cites·16 claims
- 3045US6248614B1Flip-chip package with optimized encapsulant adhesion and methodIBM·Filed 1999·Granted Jun 19, 2001·9 cites·21 claims
- 3143US2007090170A1Method of making a circuitized substrate having a plurality of solder connection sites thereonENDICOTT INTERCONNECT TECH INC·Filed 2005·Application pending·0 cites
- 3239US7067916B2Extension of fatigue life for C4 solder ball to chip connectionIBM·Filed 2001·Granted Jun 27, 2006·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →