Inventor · disambiguated record
James Allen Schlueter
Also filed as: SCHLUETER JAMES · SCHLUETER JAMES A · SCHLUETER JAMES ALLEN
18 granted patents·10 pending applications·157 citations·filing 1998–2022
93Inventor score
Files withAIR PROD & CHEM14VERSUM MAT US LLC9NOVELLUS SYSTEMS INC2DUPONT AIR PROD NANOMATERIALS1SPEEDFAM IPEC1
Top patents by PatentIndex Score
28 records- 0196US9305806B2Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applicationsAIR PROD & CHEM·Filed 2015·Granted Apr 5, 2016·9 cites·11 claims
- 0289US8974692B2Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applicationsAIR PROD & CHEM·Filed 2013·Granted Mar 10, 2015·5 cites·6 claims
- 0388US8999193B2Chemical mechanical polishing composition having chemical additives and methods for using sameAIR PROD & CHEM·Filed 2013·Granted Apr 7, 2015·10 cites·12 claims
- 0487US10032644B2Barrier chemical mechanical planarization slurries using ceria-coated silica abrasivesAIR PROD & CHEM·Filed 2016·Granted Jul 24, 2018·5 cites·18 claims
- 0587US9978609B2Low dishing copper chemical mechanical planarizationAIR PROD & CHEM·Filed 2016·Granted May 22, 2018·6 cites·12 claims
- 0686US7195548B1Method and apparatus for post-CMP cleaning of a semiconductor work pieceNOVELLUS SYSTEMS INC·Filed 2006·Granted Mar 27, 2007·15 cites·20 claims
- 0785US7678605B2Method for chemical mechanical planarization of chalcogenide materialsDUPONT AIR PROD NANOMATERIALS·Filed 2008·Granted Mar 16, 2010·10 cites·18 claims
- 0880US5989104AWorkpiece carrier with monopiece pressure plate and low gimbal pointSPEEDFAM IPEC CORP·Filed 1998·Granted Nov 23, 1999·54 cites·10 claims
- 0973US9062230B2Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereofAIR PROD & CHEM·Filed 2014·Granted Jun 23, 2015·2 cites·9 claims
- 1070US6095900AMethod for manufacturing a workpiece carrier backing pad and pressure plate for polishing semiconductor wafersSPEEDFAM IPEC·Filed 1999·Granted Aug 1, 2000·35 cites·6 claims
- 1165US9574110B2Barrier chemical mechanical planarization composition and method thereofAIR PROD & CHEM·Filed 2014·Granted Feb 21, 2017·1 cites·11 claims
- 1255US7182673B2Method and apparatus for post-CMP cleaning of a semiconductor work pieceNOVELLUS SYSTEMS INC·Filed 2004·Granted Feb 27, 2007·5 cites·46 claims
- 1355US2019172720A1Chemical Mechanical Polishing (CMP) of Cobalt-Containing SubstrateVERSUM MAT US LLC·Filed 2019·Application pending·0 cites
- 1454US10011741B2Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereofAIR PROD & CHEM·Filed 2016·Granted Jul 3, 2018·0 cites·8 claims
- 1554US8859428B2Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereofAIR PROD & CHEM·Filed 2013·Granted Oct 14, 2014·0 cites·8 claims
- 1654US2024425723A1Pad-in-a-bottle chemical mechanical planarization polishing with cost-effective non-porous solid polishing padsVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 1754US2025014911A1Pad-in-a-bottle and single platen chemical mechanical-planarization for back-end applicationsVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 1852US9305476B2Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereofAIR PROD & CHEM·Filed 2015·Granted Apr 5, 2016·0 cites·11 claims
- 1952US2020102476A1Barrier Slurry Removal Rate ImprovementVERSUM MAT US LLC·Filed 2019·Application pending·0 cites
- 2050US2015104940A1Barrier chemical mechanical planarization composition and method thereofAIR PROD & CHEM·Filed 2013·Application pending·0 cites
- 2147US10217645B2Chemical mechanical polishing (CMP) of cobalt-containing substrateAIR PROD & CHEM·Filed 2015·Granted Feb 26, 2019·0 cites·7 claims
- 2247US2022372332A1With-In Die Non-Uniformities (WID-NU) In PlanarizationVERSUM MAT US LLC·Filed 2020·Application pending·0 cites
- 2345US11066575B2Chemical mechanical planarization for tungsten-containing substratesVERSUM MAT US LLC·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 2445US2020277514A1Chemical Mechanical Polishing For Copper And Through Silicon Via ApplicationsVERSUM MAT US LLC·Filed 2020·Application pending·0 cites
- 2543US10745589B2Chemical mechanical polishing (CMP) of cobalt-containing substrateVERSUM MAT US LLC·Filed 2017·Granted Aug 18, 2020·0 cites·19 claims
- 2643US2020308452A1Low Temperature Mechanical Polishing Or Planarization Slurry For Surfactant SolubilityVERSUM MAT US LLC·Filed 2020·Application pending·0 cites
- 2743US2014315386A1Metal Compound Coated Colloidal Particles Process for Making and Use ThereforAIR PROD & CHEM·Filed 2014·Application pending·0 cites
- 2841US2014273458A1Chemical Mechanical Planarization for Tungsten-Containing SubstratesAIR PROD & CHEM·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →