Inventor · disambiguated record
Tannaz Harirchian
Also filed as: HARIRCHIAN TANNAZ
6 granted patents·2 pending applications·112 citations·filing 2012–2018
82Inventor score
Files withINTEL CORP8
Top patents by PatentIndex Score
8 records- 0197US9153552B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2014·Granted Oct 6, 2015·43 cites·8 claims
- 0297US8912670B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2012·Granted Dec 16, 2014·53 cites·10 claims
- 0394US9520376B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2015·Granted Dec 13, 2016·11 cites·7 claims
- 0484US10424559B2Thermal management of molded packagesINTEL CORP·Filed 2016·Granted Sep 24, 2019·5 cites·27 claims
- 0548US11469185B2Standoff members for semiconductor packageINTEL CORP·Filed 2017·Granted Oct 11, 2022·0 cites·25 claims
- 0646US2018190596A1Standoff members for semiconductor packageINTEL CORP·Filed 2016·Application pending·0 cites
- 0744US11769753B2Thermally-optimized tunable stack in cavity package-on-packageINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·11 claims
- 0831US2018068926A1Energy storage material for thermal management and associated techniques and configurationsINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →