Inventor · disambiguated record
David Razu
Also filed as: RAZU DAVID · RAZU DAVID S
16 granted patents·892 citations·filing 1994–2018
96Inventor score
Top patents by PatentIndex Score
16 records- 0199US9406645B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 2, 2016·40 cites·14 claims
- 0299US8710649B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 29, 2014·47 cites·20 claims
- 0399US7932595B1Electronic component package comprising fan-out tracesAMKOR TECHNOLOGY INC·Filed 2010·Granted Apr 26, 2011·66 cites·18 claims
- 0499US7714431B1Electronic component package comprising fan-out and fan-in tracesAMKOR TECHNOLOGY INC·Filed 2006·Granted May 11, 2010·98 cites·20 claims
- 0599US7192807B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·139 cites·18 claims
- 0698US6905914B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·117 cites·22 claims
- 0796US8298866B1Wafer level package and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Oct 30, 2012·16 cites·20 claims
- 0896US8119455B1Wafer level package fabrication methodHUEMOELLER RONALD PATRICK·Filed 2011·Granted Feb 21, 2012·15 cites·19 claims
- 0995US5381042APackaged integrated circuit including heat slug having an exposed surfaceAMKOR ELECTRONICS INC·Filed 1994·Granted Jan 10, 1995·257 cites·16 claims
- 1094US8691632B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 8, 2014·8 cites·20 claims
- 1194US8486764B1Wafer level package and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Jul 16, 2013·9 cites·20 claims
- 1286US9871015B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 16, 2018·2 cites·20 claims
- 1386US9054117B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Jun 9, 2015·3 cites·20 claims
- 1481US6309916B1Method of molding plastic semiconductor packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Oct 30, 2001·74 cites·13 claims
- 1576US8952522B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Feb 10, 2015·1 cites·20 claims
- 1669US10665567B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2018·Granted May 26, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →