Assignee
AMKOR ELECTRONICS INC
US·23 granted patents·2,812 citations·filing 1990–1996
Top patents by PatentIndex Score
23 records- 0198US5701034APackaged semiconductor die including heat sink with locking featureAMKOR ELECTRONICS INC·Filed 1994·Granted Dec 23, 1997·325 cites·13 claims
- 0298US5355283ABall grid array with via interconnectionAMKOR ELECTRONICS INC·Filed 1993·Granted Oct 11, 1994·568 cites·17 claims
- 0397US5478007AMethod for interconnection of integrated circuit chip and substrateAMKOR ELECTRONICS INC·Filed 1994·Granted Dec 26, 1995·154 cites·13 claims
- 0496US5723899ASemiconductor lead frame having connection bar and guide ringsAMKOR ELECTRONICS INC·Filed 1995·Granted Mar 3, 1998·245 cites·16 claims
- 0595US5381042APackaged integrated circuit including heat slug having an exposed surfaceAMKOR ELECTRONICS INC·Filed 1994·Granted Jan 10, 1995·257 cites·16 claims
- 0694US5583378ABall grid array integrated circuit package with thermal conductorAMKOR ELECTRONICS INC·Filed 1994·Granted Dec 10, 1996·290 cites·40 claims
- 0794US5485037ASemiconductor device having a thermal dissipator and electromagnetic shieldingAMKOR ELECTRONICS INC·Filed 1995·Granted Jan 16, 1996·174 cites·18 claims
- 0890US5829988ASocket assembly for integrated circuit chip carrier packageAMKOR ELECTRONICS INC·Filed 1996·Granted Nov 3, 1998·111 cites·51 claims
- 0990US5650593AThermally enhanced chip carrier packageAMKOR ELECTRONICS INC·Filed 1995·Granted Jul 22, 1997·126 cites·31 claims
- 1087US5482898AMethod for forming a semiconductor device having a thermal dissipator and electromagnetic shieldingAMKOR ELECTRONICS INC·Filed 1995·Granted Jan 9, 1996·84 cites·19 claims
- 1182US5854741AUnit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the sameAMKOR ELECTRONICS INC·Filed 1996·Granted Dec 29, 1998·66 cites·10 claims
- 1277US5328870AMethod for forming plastic molded package with heat sink for integrated circuit devicesAMKOR ELECTRONICS INC·Filed 1992·Granted Jul 12, 1994·51 cites·21 claims
- 1376US5482736AMethod for applying flux to ball grid array packageAMKOR ELECTRONICS INC·Filed 1994·Granted Jan 9, 1996·54 cites·13 claims
- 1476US5455462APlastic molded package with heat sink for integrated circuit devicesAMKOR ELECTRONICS INC·Filed 1993·Granted Oct 3, 1995·48 cites·22 claims
- 1575US5722161AMethod of making a packaged semiconductor die including heat sink with locking featureAMKOR ELECTRONICS INC·Filed 1996·Granted Mar 3, 1998·43 cites·21 claims
- 1675US5483100AIntegrated circuit package with via interconnections formed in a substrateAMKOR ELECTRONICS INC·Filed 1992·Granted Jan 9, 1996·45 cites·11 claims
- 1774US5378869AMethod for forming an integrated circuit package with via interconnectionAMKOR ELECTRONICS INC·Filed 1993·Granted Jan 3, 1995·41 cites·28 claims
- 1873US5827999AHomogeneous chip carrier packageAMKOR ELECTRONICS INC·Filed 1994·Granted Oct 27, 1998·48 cites·22 claims
- 1962US5672909AInterdigitated wirebond programmable fixed voltage planesAMKOR ELECTRONICS INC·Filed 1996·Granted Sep 30, 1997·30 cites·6 claims
- 2062US5596485APlastic packaged integrated circuit with heat spreaderAMKOR ELECTRONICS INC·Filed 1995·Granted Jan 21, 1997·30 cites·8 claims
- 2144US5183724AMethod of producing a strip of lead frames for integrated circuit dies in a continuous systemAMKOR ELECTRONICS INC·Filed 1990·Granted Feb 2, 1993·13 cites·12 claims
- 2233US5305043AMethod of and apparatus for producing a strip of lead frames for integrated circuit dies in a continuous systemAMKOR ELECTRONICS INC·Filed 1992·Granted Apr 19, 1994·5 cites·13 claims
- 2332US5269210ASlitter machine for use in manufacturing semiconductor devicesAMKOR ELECTRONICS INC·Filed 1991·Granted Dec 14, 1993·4 cites·10 claims
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