Inventor · disambiguated record
Soon-Kang Huang
Also filed as: HUANG SOON KANG
17 granted patents·8 pending applications·50 citations·filing 2003–2025
91Inventor score
Top patents by PatentIndex Score
25 records- 0193US10357867B2Polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 23, 2019·8 cites·20 claims
- 0291US11605566B2Method and structure for metal gatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 14, 2023·2 cites·20 claims
- 0385US12020980B2Semiconductor structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·1 cites·20 claims
- 0485US2025343070A1Semiconductor structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0582US10513006B2High throughput CMP platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 24, 2019·5 cites·20 claims
- 0682US10096482B2Apparatus and method for chemical mechanical polishing process controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 9, 2018·3 cites·20 claims
- 0782US9718164B2Polishing system and polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 1, 2017·4 cites·20 claims
- 0879US2024395602A1Semiconductor structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0977US2024363441A1Method and structure for metal gatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1075US12100627B2Method and structure for metal gatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 1174US2023386895A1Semiconductor structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1271US6821895B2Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMPTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Nov 23, 2004·15 cites·20 claims
- 1368US10090207B2Multi-point chemical mechanical polishing end point detection system and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 2, 2018·2 cites·17 claims
- 1466US7957118B2Multi-zone electrostatic chuck and chucking methodTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jun 7, 2011·4 cites·20 claims
- 1565US8188447B2Field-by-field laser annealing and feed forward process controlYANG CHUNG-RU·Filed 2009·Granted May 29, 2012·3 cites·21 claims
- 1664US11358252B2Method of using a polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·20 claims
- 1761US10668592B2Method of planarizing a waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 2, 2020·0 cites·20 claims
- 1855US9368452B2Metal conductor chemical mechanical polishTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 14, 2016·0 cites·20 claims
- 1952US7950983B2Retainer ringTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted May 31, 2011·0 cites·17 claims
- 2051US7666068B2Retainer ringTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 23, 2010·0 cites·17 claims
- 2150US7141495B2Methods and forming structures, structures and apparatuses for forming structuresTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 28, 2006·3 cites·20 claims
- 2246US2010291840A1System and method for conditioning chemical mechanical polishing apparatus using multiple conditioning disksTAIWAN SEMICONDUCTOR MFG·Filed 2009·Application pending·0 cites
- 2345US2014196744A1Method and device for cleaning a brush surface having a contaminationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 2434US2013217306A1CMP Groove Depth and Conditioning Disk MonitoringWU JIANN LIH·Filed 2012·Application pending·0 cites
- 2534US2013210173A1Multiple Zone Temperature Control for CMPWU JIANN LIH·Filed 2012·Application pending·0 cites
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