Inventor · disambiguated record
Yasuji Kaneshima
Also filed as: KANESHIMA YASUJI
10 granted patents·3 pending applications·78 citations·filing 2004–2014
88Inventor score
Technology areasH10P
Top patents by PatentIndex Score
13 records- 0196US7406759B2Releasing method and releasing apparatus of work having adhesive tapeNITTO DENKO CORP·Filed 2006·Granted Aug 5, 2008·36 cites·6 claims
- 0288US8110058B2Work bonding and supporting method and work bonding and supporting apparatus using the sameKANESHIMA YASUJI·Filed 2007·Granted Feb 7, 2012·14 cites·3 claims
- 0379US9142441B2Method of mounting a semiconductor wafer with a support board on a supporting adhesive tape joined to a ring frameNITTO DENKO CORP·Filed 2013·Granted Sep 22, 2015·4 cites·5 claims
- 0479US8281838B2Work bonding and supporting method and work bonding and supporting apparatus using the sameKANESHIMA YASUJI·Filed 2011·Granted Oct 9, 2012·4 cites·8 claims
- 0576US7987888B2Releasing method and releasing apparatus of work having adhesive tapeNITTO DENKO CORP·Filed 2008·Granted Aug 2, 2011·4 cites·6 claims
- 0673US7896050B2Apparatus for cutting the protective tape of semiconductor waferNITTO DENKO CORP·Filed 2007·Granted Mar 1, 2011·4 cites·8 claims
- 0772US7849900B2Apparatus for joining a separating adhesive tapeNITTO DENKO CORP·Filed 2006·Granted Dec 14, 2010·4 cites·9 claims
- 0870US7987886B2Protective tape joining apparatusNITTO DENKO CORP·Filed 2009·Granted Aug 2, 2011·3 cites·4 claims
- 0966US8042441B2Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tapeNITTO DENKO CORP·Filed 2007·Granted Oct 25, 2011·3 cites·2 claims
- 1065US8109185B2Method for cutting protective tape of semiconductor wafer and protective tape cutting deviceYAMAMOTO MASAYUKI·Filed 2008·Granted Feb 7, 2012·2 cites·7 claims
- 1146US2009095418A1Ultraviolet irradiation method and apparatus using the sameYAMAMOTO MASAYUKI·Filed 2008·Application pending·0 cites
- 1243US2014238207A1Adhesive tape cutting method and adhesive tape cutting apparatusNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1343US2005067097A1Releasing method and releasing apparatus of work having adhesive tapeFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →