Releasing method and releasing apparatus of work having adhesive tape

Abstract

In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.

1 . A method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the method comprising the step of: 
 releasing the work having the adhesive tape from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.    
   
   
       2 . The method according to  claim 1 , wherein 
 the gas is supplied to the entire region where the work having the adhesive tape is held between the work having the adhesive tape and the holding member.    
   
   
       3 . The method according to  claim 2 , wherein 
 the gas is supplied in sequence from a central portion to an outer side of the holding member.    
   
   
       4 . The method according to  claim 1 , wherein 
 the gas is supplied to the work having the adhesive tape in a vacuum sucked state.    
   
   
       5 . The method according to  claim 1 , wherein 
 the gas is supplied from two or more gas supply openings.    
   
   
       6 . The method according to  claim 1 , wherein 
 a back surface of the work having the adhesive tape is joined to a ring frame and the semiconductor wafer to integrally form the ring frame and the semiconductor wafer.    
   
   
       7 . An apparatus for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the apparatus comprising: 
 a holding table having a holding member for mounting and holding the work having the adhesive tape;    holding means, provided on the holding table, for sucking and holding the work having the adhesive tape; and    gas supply means for supplying a gas between the holding member and the work having the adhesive tape.    
   
   
       8 . The apparatus according to  claim 7 , further comprising: 
 a control section which switches over the suction and holding of the work having the adhesive tape by the holding means and the supply of gas between the holding member and the work having the adhesive tape by the gas supply means.    
   
   
       9 . The apparatus according to  claim 7 , wherein 
 the holding table commonly uses the discharging flow path for sucking the work having the adhesive tape by the holding means, and the flow path for supplying the gas by the gas supply means.    
   
   
       10 . The apparatus according to  claim 7 , wherein 
 the holding table separately includes the discharging flow path for sucking the work having the adhesive tape by the holding means, and the flow path for supplying the gas by the gas supply means.    
   
   
       11 . The apparatus according to  claim 7 , wherein 
 the holding member is made of a porous material.    
   
   
       12 . The apparatus according to  claim 7 , wherein 
 a back surface of the work having the adhesive tape is joined to the ring frame and the semiconductor wafer to integrally form the ring frame and the semiconductor wafer.