Inventor · disambiguated record
Jirou Miura
Also filed as: MIURA JIROU
9 granted patents·2 pending applications·86 citations·filing 2000–2012
87Inventor score
Files withFUJITSU LTD5FUJITSU MICROELECTRONICS LTD2FUJITSU SEMICONDUCTOR LTD2KIKUCHI HIDEAKI1MIURA JIROU1
Top patents by PatentIndex Score
11 records- 0187US6509593B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2000·Granted Jan 21, 2003·50 cites·4 claims
- 0286US8227337B2Semiconductor device having metal wirings of laminated structureKIKUCHI HIDEAKI·Filed 2010·Granted Jul 24, 2012·7 cites·9 claims
- 0380US7498625B2Semiconductor device and manufacturing method thereofFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Mar 3, 2009·8 cites·43 claims
- 0468US7507621B2Method of manufacturing semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Mar 24, 2009·3 cites·17 claims
- 0564US7880302B2Semiconductor device having metal wirings of laminated structureFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Feb 1, 2011·1 cites·7 claims
- 0663US8124476B2Semiconductor device and method of manufacturing the sameMIURA JIROU·Filed 2009·Granted Feb 28, 2012·2 cites·13 claims
- 0762US6913970B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2002·Granted Jul 5, 2005·10 cites·15 claims
- 0857US7211850B2Semiconductor device with specifically shaped contact holesFUJITSU LTD·Filed 2004·Granted May 1, 2007·5 cites·7 claims
- 0952US8361861B2Semiconductor device and method of manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2012·Granted Jan 29, 2013·0 cites·13 claims
- 1050US2007184595A1Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1149US2007090438A1Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →