Inventor · disambiguated record
Andrew D. Bailey, Iii
Also filed as: BAILEY ANDREW · BAILEY ANDREW D · BAILEY ANDREW D III · BAILEY ANDREW DAVID
135 granted patents·30 pending applications·3,223 citations·filing 1999–2023
99Inventor score
Top patents by PatentIndex Score
165 records- 0199US7858898B2Bevel etcher with gap controlLAM RES CORP·Filed 2007·Granted Dec 28, 2010·349 cites·19 claims
- 0299US7611640B1Minimizing arcing in a plasma processing chamberLAM RES CORP·Filed 2006·Granted Nov 3, 2009·365 cites·33 claims
- 0399US7086347B2Apparatus and methods for minimizing arcing in a plasma processing chamberLAM RES CORP·Filed 2002·Granted Aug 8, 2006·380 cites·31 claims
- 0499US6320320B1Method and apparatus for producing uniform process ratesLAM RES CORP·Filed 1999·Granted Nov 20, 2001·411 cites·40 claims
- 0598US9039911B2Plasma-enhanced etching in an augmented plasma processing systemLAM RES CORP·Filed 2012·Granted May 26, 2015·57 cites·23 claims
- 0698US8652298B2Triode reactor design with multiple radiofrequency powersDHINDSA RAJINDER·Filed 2011·Granted Feb 18, 2014·160 cites·20 claims
- 0797US11594400B2Multi zone gas injection upper electrode systemLAM RES CORP·Filed 2020·Granted Feb 28, 2023·6 cites·11 claims
- 0897US10197908B2Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling frameworkLAM RES CORP·Filed 2016·Granted Feb 5, 2019·27 cites·32 claims
- 0997US8869742B2Plasma processing chamber with dual axial gas injection and exhaustDHINDSA RAJINDER·Filed 2010·Granted Oct 28, 2014·195 cites·21 claims
- 1097US7480571B2Apparatus and methods for improving the stability of RF power delivery to a plasma loadLAM RES CORP·Filed 2004·Granted Jan 20, 2009·84 cites·20 claims
- 1196US10572697B2Method of etch model calibration using optical scatterometryLAM RES CORP·Filed 2018·Granted Feb 25, 2020·9 cites·34 claims
- 1296US9996647B2Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimizationLAM RES CORP·Filed 2017·Granted Jun 12, 2018·12 cites·31 claims
- 1396US9792393B2Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimizationLAM RES CORP·Filed 2016·Granted Oct 17, 2017·19 cites·34 claims
- 1496US6341574B1Plasma processing systemsLAM RES CORP·Filed 1999·Granted Jan 29, 2002·135 cites·2 claims
- 1595US10534257B2Layout pattern proximity correction through edge placement error predictionLAM RES CORP·Filed 2017·Granted Jan 14, 2020·17 cites·14 claims
- 1695US9184028B2Dual plasma volume processing apparatus for neutral/ion flux controlDHINDSA RAJINDER·Filed 2010·Granted Nov 10, 2015·34 cites·32 claims
- 1795US8900398B2Local plasma confinement and pressure control arrangement and methods thereofDHINDSA RAJINDER·Filed 2010·Granted Dec 2, 2014·27 cites·14 claims
- 1894US10585347B2Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling frameworkLAM RES CORP·Filed 2018·Granted Mar 10, 2020·9 cites·21 claims
- 1994US10262910B2Method of feature exaction from time-series of spectra to control endpoint of processLAM RES CORP·Filed 2016·Granted Apr 16, 2019·12 cites·16 claims
- 2094US7943007B2Configurable bevel etcherLAM RES CORP·Filed 2007·Granted May 17, 2011·24 cites·11 claims
- 2194US7651585B2Apparatus for the removal of an edge polymer from a substrate and methods thereforLAM RES CORP·Filed 2005·Granted Jan 26, 2010·27 cites·13 claims
- 2293US10303830B2Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimizationLAM RES CORP·Filed 2018·Granted May 28, 2019·9 cites·29 claims
- 2393US10032681B2Etch metric sensitivity for endpoint detectionLAM RES CORP·Filed 2016·Granted Jul 24, 2018·25 cites·39 claims
- 2493US8580078B2Bevel etcher with vacuum chuckBAILEY III ANDREW D·Filed 2007·Granted Nov 12, 2013·20 cites·11 claims
- 2593US7067034B2Method and apparatus for plasma forming inner magnetic bucket to control a volume of a plasmaLAM RES CORP·Filed 2000·Granted Jun 27, 2006·46 cites·19 claims
- 2692US7413673B2Method for adjusting voltage on a powered Faraday shieldLAM RES CORP·Filed 2005·Granted Aug 19, 2008·17 cites·13 claims
- 2792US6322661B1Method and apparatus for controlling the volume of a plasmaLAM RES CORP·Filed 1999·Granted Nov 27, 2001·75 cites·48 claims
- 2891US11670486B2Pulsed plasma chamber in dual chamber configurationLAM RES CORP·Filed 2020·Granted Jun 6, 2023·2 cites·11 claims
- 2991US8721908B2Bevel etcher with vacuum chuckLAM RES CORP·Filed 2013·Granted May 13, 2014·9 cites·13 claims
- 3091US8225683B2Wafer bow metrology arrangements and methods thereofBAILEY III ANDREW D·Filed 2008·Granted Jul 24, 2012·15 cites·20 claims
- 3191US7486878B2Offset correction methods and arrangement for positioning and inspecting substratesLAM RES CORP·Filed 2006·Granted Feb 3, 2009·25 cites·30 claims
- 3290US10997345B2Method of etch model calibration using optical scatterometryLAM RES CORP·Filed 2020·Granted May 4, 2021·3 cites·34 claims
- 3390US10386828B2Methods and apparatuses for etch profile matching by surface kinetic model optimizationLAM RES CORP·Filed 2015·Granted Aug 20, 2019·8 cites·33 claims
- 3490US8883027B2Methods for removing a metal oxide from a substrateYOON HYUNGSUK ALEXANDER·Filed 2010·Granted Nov 11, 2014·10 cites·30 claims
- 3590US7479236B2Offset correction techniques for positioning substratesLAM RES CORP·Filed 2006·Granted Jan 20, 2009·20 cites·22 claims
- 3690US6838832B1Apparatus and methods for improving the stability of RF power delivery to a plasma loadLAM RES CORP·Filed 2002·Granted Jan 4, 2005·34 cites·174 claims
- 3789US9418859B2Plasma-enhanced etching in an augmented plasma processing systemLAM RES CORP·Filed 2015·Granted Aug 16, 2016·5 cites·16 claims
- 3889US7938931B2Edge electrodes with variable powerLAM RES CORP·Filed 2007·Granted May 10, 2011·11 cites·12 claims
- 3988US9735069B2Method and apparatus for determining process rateLAM RES CORP·Filed 2015·Granted Aug 15, 2017·5 cites·13 claims
- 4088US7909960B2Apparatus and methods to remove films on bevel edge and backside of waferLAM RES CORP·Filed 2006·Granted Mar 22, 2011·11 cites·9 claims
- 4187US7009281B2Small volume process chamber with hot inner surfacesLAM CORP·Filed 2003·Granted Mar 7, 2006·39 cites·7 claims
- 4286US7718542B2Low-k damage avoidance during bevel etch processingLAM RES CORP·Filed 2006·Granted May 18, 2010·8 cites·31 claims
- 4386US7239737B2User interface for quantifying wafer non-uniformities and graphically explore significanceLAM RES CORP·Filed 2002·Granted Jul 3, 2007·36 cites·22 claims
- 4485US10386821B2Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated valuesLAM RES CORP·Filed 2015·Granted Aug 20, 2019·3 cites·44 claims
- 4585US9053925B2Configurable bevel etcherBAILEY III ANDREW D·Filed 2011·Granted Jun 9, 2015·6 cites·13 claims
- 4684US8135485B2Offset correction techniques for positioning substrates within a processing chamberCHEN JACK·Filed 2008·Granted Mar 13, 2012·10 cites·19 claims
- 4784US7662254B2Methods of and apparatus for aligning electrodes in a process chamber to protect an exclusion area within an edge environ of a waferLAM RES CORP·Filed 2007·Granted Feb 16, 2010·8 cites·12 claims
- 4884US7662253B2Apparatus for the removal of a metal oxide from a substrate and methods thereforLAM RES CORP·Filed 2005·Granted Feb 16, 2010·8 cites·20 claims
- 4984US6302966B1Temperature control system for plasma processing apparatusLAM RES CORP·Filed 1999·Granted Oct 16, 2001·42 cites·26 claims
- 5083US7403001B1Methods and apparatus for measuring morphology of a conductive film on a substrateLAM RES CORP·Filed 2005·Granted Jul 22, 2008·13 cites·25 claims
Showing the top 50 of 165 patent records by PatentIndex Score.
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