Inventor · disambiguated record
Hisashi Masumura
Also filed as: MASUMURA HISASHI
36 granted patents·8 pending applications·868 citations·filing 1994–2021
98Inventor score
Files withSHINETSU HANDOTAI KK34MASUMURA HISASHI7SHIN ETSU HANDOTAI CO LTD2SHIN ESTU HANDOTAI CO LTD1
Top patents by PatentIndex Score
44 records- 0194US5942445AMethod of manufacturing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 24, 1999·163 cites·20 claims
- 0290US9266216B2Polishing head and polishing apparatusSHINETSU HANDOTAI KK·Filed 2013·Granted Feb 23, 2016·10 cites·15 claims
- 0387US7582221B2Wafer manufacturing method, polishing apparatus, and waferSHINETSU HANDOTAI KK·Filed 2001·Granted Sep 1, 2009·33 cites·9 claims
- 0486US5800725AMethod of manufacturing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Sep 1, 1998·80 cites·13 claims
- 0583US6135854AAutomatic workpiece transport apparatus for double-side polishing machineSHINETSU HANDOTAI KK·Filed 1999·Granted Oct 24, 2000·71 cites·5 claims
- 0683US6042688ACarrier for double-side polishingSHINETSU HANDOTAI KK·Filed 1998·Granted Mar 28, 2000·54 cites·7 claims
- 0780US7740521B2Polishing head, polishing apparatus and polishing method for semiconductor waferSHINETSU HANDOTAI KK·Filed 2006·Granted Jun 22, 2010·11 cites·10 claims
- 0880US5951374AMethod of polishing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Sep 14, 1999·57 cites·16 claims
- 0977US8092281B2Polishing head and polishing apparatusMASUMURA HISASHI·Filed 2007·Granted Jan 10, 2012·6 cites·16 claims
- 1076US6422922B1Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpieceSHINETSU HANDOTAI KK·Filed 2000·Granted Jul 23, 2002·18 cites·6 claims
- 1175US6120353APolishing method for semiconductor wafer and polishing pad used thereinSHINETSU HANDOTAI KK·Filed 1999·Granted Sep 19, 2000·38 cites·4 claims
- 1273US6306021B1Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1999·Granted Oct 23, 2001·31 cites·14 claims
- 1371US5914053AApparatus and method for double-sided polishing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1996·Granted Jun 22, 1999·39 cites·20 claims
- 1470US5494862AMethod of making semiconductor wafersSHINETSU HANDOTAI KK·Filed 1994·Granted Feb 27, 1996·47 cites·6 claims
- 1566US6332830B1Polishing method and polishing deviceSHINETSU HANDOTAI KK·Filed 1999·Granted Dec 25, 2001·24 cites·20 claims
- 1665US8268114B2Workpiece holder for polishing, workpiece polishing apparatus and polishing methodMASUMURA HISASHI·Filed 2002·Granted Sep 18, 2012·10 cites·8 claims
- 1764US5827779AMethod of manufacturing semiconductor mirror wafersSHINETSU HANDOTAI KK·Filed 1996·Granted Oct 27, 1998·28 cites·8 claims
- 1861US8021210B2Polishing head and polishing apparatus having the sameSHINETSU HANDOTAI KK·Filed 2008·Granted Sep 20, 2011·2 cites·20 claims
- 1960US5821167AMethod of manufacturing semiconductor mirror wafersSHINETSU HANDOTAI KK·Filed 1996·Granted Oct 13, 1998·24 cites·18 claims
- 2058US6558233B1Wafer polishing method, wafer cleaning method and wafer protective filmSHINETSU HANDOTAI KK·Filed 2000·Granted May 6, 2003·7 cites·13 claims
- 2157US8323075B2Polishing head, polishing apparatus and method for demounting workpieceMASUMURA HISASHI·Filed 2007·Granted Dec 4, 2012·2 cites·16 claims
- 2255US6769966B2Workpiece holder for polishing, polishing apparatus and polishing methodSHINETSU HANDOTAI KK·Filed 2001·Granted Aug 3, 2004·5 cites·20 claims
- 2355US2009057840A1Wafer manufacturing method, polishing apparatus, and waferSHINETSU HANDOTAI KK·Filed 2008·Application pending·0 cites
- 2454US7695347B2Method and pad for polishing waferSHINETSU HANDOTAI KK·Filed 2002·Granted Apr 13, 2010·7 cites·5 claims
- 2553US6729941B2Process for manufacturing semiconductor wafer and semiconductor waferSHIN ETSU HANDOTAI & CO LTD·Filed 2001·Granted May 4, 2004·3 cites·16 claims
- 2652US6386957B1Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatusSHINETSU HANDOTAI KK·Filed 1999·Granted May 14, 2002·17 cites·12 claims
- 2750US5447890AMethod for production of waferSHINETSU HANDOTAI KK·Filed 1994·Granted Sep 5, 1995·20 cites·3 claims
- 2848US5827395APolishing pad used for polishing silicon wafers and polishing method using the sameSHINETSU HANDOTAI KK·Filed 1995·Granted Oct 27, 1998·12 cites·8 claims
- 2947US8636561B2Polishing head and polishing apparatusMASUMURA HISASHI·Filed 2009·Granted Jan 28, 2014·0 cites·10 claims
- 3047US2011070813A1Method for manufacturing polishing head and polishing apparatusSHINETSU HANDOTAI KK·Filed 2009·Application pending·0 cites
- 3146US5759087AMethod for inducing damage for gettering to single crystal silicon waferSHINETSU HANDOTAI KK·Filed 1995·Granted Jun 2, 1998·12 cites·22 claims
- 3245US2010210192A1Polishing head and polishing apparatusSHINETSU HANDOTAI KK·Filed 2007·Application pending·0 cites
- 3343US2004224519A1Process for manufacturing semiconductor wafer and semiconductor waferSHINETSU HANDOTAI KK·Filed 2004·Application pending·0 cites
- 3442US12500077B2Epitaxial wafer cleaning methodSHIN ETSU HANDOTAI CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·6 claims
- 3542US5866226APolishing agent used for polishing semiconductor wafers and polishing method using the sameSHINETSU HANDOTAI KK·Filed 1996·Granted Feb 2, 1999·8 cites·8 claims
- 3640US5891353APolishing agent used for polishing semiconductor wafers and polishing method using the sameSHINETSU HANDOTAI KK·Filed 1997·Granted Apr 6, 1999·6 cites·8 claims
- 3740US5790252AMethod of and apparatus for determining residual damage to wafer edgesSHINETSU HANDOTAI KK·Filed 1996·Granted Aug 4, 1998·10 cites·2 claims
- 3840US2014101925A1Polishing head, polishing apparatus, and method for polishing workpieceMASUMURA HISASHI·Filed 2012·Application pending·0 cites
- 3940US2014113531A1Polishing head and polishing apparatusMASUMURA HISASHI·Filed 2012·Application pending·0 cites
- 4038US5705423AEpitaxial waferSHINETSU HANDOTAI KK·Filed 1995·Granted Jan 6, 1998·9 cites·2 claims
- 4137US2012309175A1Vapor-phase growth semiconductor substrate support susceptor, epitaxial wafer manufacturing apparatus, and epitaxial wafer manufacturing methodMASUMURA HISASHI·Filed 2011·Application pending·0 cites
- 4237US2002031990A1Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafersSHIN ESTU HANDOTAI CO LTD·Filed 2001·Application pending·0 cites
- 4332US6399498B1Method and apparatus for polishing workSHINETSU HANDOTAI KK·Filed 1999·Granted Jun 4, 2002·2 cites·8 claims
- 4432US5667567APolishing agent used for polishing silicon wafers and polishing method using the sameSHINETSU HANDOTAI KK·Filed 1996·Granted Sep 16, 1997·2 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →