Inventor · disambiguated record
Tatsuya Kohama
Also filed as: KOHAMA TATSUYA
9 granted patents·6 pending applications·113 citations·filing 2001–2020
85Inventor score
Top patents by PatentIndex Score
15 records- 0197US8497476B2Inspection deviceHATAKEYAMA MASAHIRO·Filed 2012·Granted Jul 30, 2013·42 cites·10 claims
- 0290US6663469B2Polishing method and apparatusEBARA CORP·Filed 2001·Granted Dec 16, 2003·57 cites·30 claims
- 0387US8624182B2Electro-optical inspection apparatus and method with dust or particle collection functionWATANABE KENJI·Filed 2011·Granted Jan 7, 2014·7 cites·12 claims
- 0486US10157722B2Inspection deviceEBARA CORP·Filed 2016·Granted Dec 18, 2018·3 cites·15 claims
- 0570US7960188B2Polishing methodEBARA CORP·Filed 2009·Granted Jun 14, 2011·3 cites·4 claims
- 0665US8884225B2Sample observing device and sample observing methodEBARA CORP·Filed 2012·Granted Nov 11, 2014·1 cites·8 claims
- 0760US2014014848A1Inspection deviceEBARA CORP·Filed 2013·Application pending·0 cites
- 0856US9105444B2Electro-optical inspection apparatus and method with dust or particle collection functionEBARA CORP·Filed 2013·Granted Aug 11, 2015·0 cites·8 claims
- 0954US11217421B2Adjustment method and electron beam deviceEBARA CORP·Filed 2020·Granted Jan 4, 2022·0 cites·5 claims
- 1049US2007238395A1Substrate polishing apparatus and substrate polishing methodKIMURA NORIO·Filed 2007·Application pending·0 cites
- 1145US2009142990A1Method for polishing a workpieceKOHAMA TATSUYA·Filed 2009·Application pending·0 cites
- 1238US2002023715A1Substrate polishing apparatus and substrate polishing mehodFiled 2001·Application pending·0 cites
- 1337US2007135024A1Polishing pad and polishing apparatusKOBATA ITSUKI·Filed 2006·Application pending·0 cites
- 1437US2006105678A1Polishing apparatus and polishing methodKOHAMA TATSUYA·Filed 2005·Application pending·0 cites
- 1536US7077730B2Method and apparatus for polishing a workpieceEBARA CORP·Filed 2004·Granted Jul 18, 2006·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →