Inventor · disambiguated record
Paul William Dryer
Also filed as: DRYER PAUL · DRYER PAUL W · DRYER PAUL WILLIAM
31 granted patents·6 pending applications·364 citations·filing 1995–2021
96Inventor score
Top patents by PatentIndex Score
37 records- 0192US6021791AMethod and apparatus for immersion cleaning of semiconductor devicesSPEEDFAM IPEC CORP·Filed 1998·Granted Feb 8, 2000·115 cites·35 claims
- 0291US10814638B2Fluidic ejection cartridge for improved protective tape removalFUNAI ELECTRIC CO·Filed 2019·Granted Oct 27, 2020·3 cites·12 claims
- 0387US6284055B1Method and apparatus for immersion treatment of semiconductor and other devicesZ CAP L L C·Filed 2000·Granted Sep 4, 2001·33 cites·20 claims
- 0485US7531047B1Method of removing residue from a substrate after a DRIE processLEXMARK INT INC·Filed 2007·Granted May 12, 2009·10 cites·5 claims
- 0583US10987935B1Organic solvent sealing tapeFUNAI ELECTRIC CO·Filed 2020·Granted Apr 27, 2021·1 cites·13 claims
- 0683US7938513B2Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chipsLEXMARK INT INC·Filed 2008·Granted May 10, 2011·7 cites·20 claims
- 0782US9365044B1Printhead cartridge with hydrophobic coatingFUNAI ELECTRIC CO·Filed 2014·Granted Jun 14, 2016·2 cites·18 claims
- 0882US9132654B1Label for inkjet printheadFUNAI ELECTRIC CO·Filed 2014·Granted Sep 15, 2015·3 cites·20 claims
- 0982US8087756B2Heater chips with silicon die bonded on silicon substrateANDERSON FRANK EDWARD·Filed 2011·Granted Jan 3, 2012·5 cites·3 claims
- 1079US10384458B1Fluidic ejection cartridge for improved protective tape removalFUNAI ELECTRIC CO·Filed 2018·Granted Aug 20, 2019·2 cites·20 claims
- 1178US9630416B2Printhead cartridge with hydrophobic coatingFUNAI ELECTRIC CO·Filed 2016·Granted Apr 25, 2017·1 cites·16 claims
- 1271US5824601ACarboxylic acid etching solution and methodMOTOROLA INC·Filed 1997·Granted Oct 20, 1998·47 cites·41 claims
- 1368US8324076B2Micro-fluid ejection heads and methods for bonding substrates to supportsBERNARD DAVID LAURIER·Filed 2010·Granted Dec 4, 2012·2 cites·7 claims
- 1468US7735952B2Method of bonding a micro-fluid ejection head to a support substrateLEXMARK INT INC·Filed 2007·Granted Jun 15, 2010·2 cites·20 claims
- 1567US8728715B2Non-photosensitive siloxane coating for processing hydrophobic photoimageable nozzle plateBERNARD DAVID·Filed 2012·Granted May 20, 2014·1 cites·22 claims
- 1666US8785524B2Spray coatable adhesive for bonding silicon dies to rigid substratesWU XIAOMING·Filed 2011·Granted Jul 22, 2014·1 cites·16 claims
- 1766US6641675B2Method and apparatus for immersion treatment of semiconductor and other devicesZ CAP L L C·Filed 2001·Granted Nov 4, 2003·8 cites·47 claims
- 1866US6187216B1Method for etching a dielectric layer over a semiconductor substrateMOTOROLA INC·Filed 1997·Granted Feb 13, 2001·38 cites·13 claims
- 1965US8956450B2Formulation for silicon-doped ink used to prevent chip etchingDRYER PAUL WILLIAM·Filed 2012·Granted Feb 17, 2015·1 cites·8 claims
- 2064US9844940B2Printhead cartridge with hydrophobic coatingFUNAI ELECTRIC CO·Filed 2017·Granted Dec 19, 2017·0 cites·14 claims
- 2162US6146468ASemiconductor wafer treatmentSPEEDFAM IPEC CORP·Filed 1999·Granted Nov 14, 2000·27 cites·56 claims
- 2261US8071275B2Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methodsBERNARD DAVID LAURIER·Filed 2008·Granted Dec 6, 2011·1 cites·10 claims
- 2359US11938477B2Microfluidic cartridge comprising silicone pressure-sensitive adhesivePROCTER & GAMBLE·Filed 2020·Granted Mar 26, 2024·0 cites·11 claims
- 2459US6415803B1Method and apparatus for semiconductor wafer cleaning with reuse of chemicalsZ CAP L L C·Filed 1999·Granted Jul 9, 2002·25 cites·11 claims
- 2558US11433681B2Sealing tape for organic solvent-based fluidic cartridgesFUNAI ELECTRIC CO·Filed 2021·Granted Sep 6, 2022·0 cites·20 claims
- 2654US2014203114A1Non-photosensitive siloxane coating for processing hydrophobic photoimageable nozzle plateFUNAI ELECTRIC CO·Filed 2014·Application pending·0 cites
- 2752US5593538AMethod for etching a dielectric layer on a semiconductorMOTOROLA INC·Filed 1995·Granted Jan 14, 1997·21 cites·20 claims
- 2850US7815289B2Micro-fluid ejection heads and methods for bonding substrates to supportsLEXMARK INT INC·Filed 2007·Granted Oct 19, 2010·0 cites·6 claims
- 2948US2010206840A1Bonding a micro-fluid ejection head to a support substrateBERNARD DAVID L·Filed 2010·Application pending·0 cites
- 3047US8826502B2Method for making a substantially planar micro-fluid ejection headBERNARD DAVID LAURIER·Filed 2010·Granted Sep 9, 2014·0 cites·19 claims
- 3147US2008186367A1Ink tank having integrated rfid tagLEXMARK INT INC·Filed 2007·Application pending·0 cites
- 3246US2008186187A1Ink tank having integrated rfid tagADKINS CHRISTOPHER ALAN·Filed 2007·Application pending·0 cites
- 3345US8882221B2Modular micro-fluid ejection head assemblyBERNARD DAVID LAURIER·Filed 2008·Granted Nov 11, 2014·0 cites·4 claims
- 3445US6244280B1Method and apparatus for immersion treatment of semiconductor and other devicesSPEEDFAM IPEC CORP·Filed 1999·Granted Jun 12, 2001·8 cites·6 claims
- 3543US2008083700A1Method and Apparatus for Maximizing Cooling for Wafer ProcessingLEXMARK INT INC·Filed 2006·Application pending·0 cites
- 3643US2013048601A1Use of Hydrogen-Oxygen Plasma for Forming Hydroxyl Functional Groups on a Polymer SurfaceDRYER PAUL·Filed 2011·Application pending·0 cites
- 3736US8491095B2Fluid ejection device and method for fabricating fluid ejection deviceMCNEES ANDREW L·Filed 2011·Granted Jul 23, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →