Inventor · disambiguated record
Zbigniew J. Radzimski
Also filed as: RADZIMSKI ZBIGNIEW J
10 granted patents·67 citations·filing 2000–2001
88Inventor score
Files withSEH AMERICA INC10
Top patents by PatentIndex Score
10 records- 0173US6673147B2High resistivity silicon wafer having electrically inactive dopant and method of producing sameSEH AMERICA INC·Filed 2001·Granted Jan 6, 2004·16 cites·33 claims
- 0271US6669777B2Method of producing a high resistivity silicon wafer utilizing heat treatment that occurs during device fabricationSEH AMERICA INC·Filed 2001·Granted Dec 30, 2003·9 cites·19 claims
- 0370US6565652B1High resistivity silicon wafer and method of producing same using the magnetic field Czochralski methodSEH AMERICA INC·Filed 2001·Granted May 20, 2003·8 cites·11 claims
- 0464US6632277B2Optimized silicon wafer gettering for advanced semiconductor devicesSEH AMERICA INC·Filed 2001·Granted Oct 14, 2003·11 cites·12 claims
- 0562US6454852B2High efficiency silicon wafer optimized for advanced semiconductor devicesSEH AMERICA INC·Filed 2001·Granted Sep 24, 2002·9 cites·33 claims
- 0660US6583024B1High resistivity silicon wafer with thick epitaxial layer and method of producing sameSEH AMERICA INC·Filed 2001·Granted Jun 24, 2003·7 cites·20 claims
- 0758US6565651B2Optimized silicon wafer strength for advanced semiconductor devicesSEH AMERICA INC·Filed 2001·Granted May 20, 2003·3 cites·23 claims
- 0850US6395085B2Purity silicon wafer for use in advanced semiconductor devicesSEH AMERICA INC·Filed 2001·Granted May 28, 2002·3 cites·21 claims
- 0949US6669775B2High resistivity silicon wafer produced by a controlled pull rate czochralski methodSEH AMERICA INC·Filed 2001·Granted Dec 30, 2003·1 cites·16 claims
- 1029US6416391B1Method of demounting silicon wafers after polishingSEH AMERICA INC·Filed 2000·Granted Jul 9, 2002·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →