Inventor · disambiguated record
Joseph Minacapelli
Also filed as: MINACAPELLI JOSEPH · MINACAPELLI JOSEPH S
9 granted patents·3 pending applications·83 citations·filing 2002–2023
86Inventor score
Top patents by PatentIndex Score
12 records- 0194US9425171B1Removable substrate for controlling warpage of an integrated circuit packageNVIDIA CORP·Filed 2015·Granted Aug 23, 2016·13 cites·20 claims
- 0293US11699662B2Face-to-face dies with probe pads for pre-assembly testingNVIDIA CORP·Filed 2020·Granted Jul 11, 2023·5 cites·20 claims
- 0390US6797998B2Multi-configuration GPU interface deviceNVIDIA CORP·Filed 2002·Granted Sep 28, 2004·49 cites·32 claims
- 0484US11127719B2Face-to-face dies with enhanced power delivery using extended TSVSNVIDIA CORP·Filed 2020·Granted Sep 21, 2021·2 cites·20 claims
- 0577US11616023B2Face-to-face dies with a void for enhanced inductor performanceNVIDIA CORP·Filed 2020·Granted Mar 28, 2023·1 cites·21 claims
- 0677US9728481B2System with a high power chip and a low power chip having low interconnect parasiticsYEE ABRAHAM F·Filed 2011·Granted Aug 8, 2017·6 cites·10 claims
- 0766US2023230925A1Face-to-face dies with a void for enhanced inductor performanceNVIDIA CORP·Filed 2023·Application pending·0 cites
- 0865US11973060B2Extended through wafer vias for power delivery in face-to-face diesNVIDIA CORP·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 0959US2024266106A1Via-based inductor coil for integrated silicon applicationsNVIDIA CORP·Filed 2023·Application pending·0 cites
- 1056US7353480B1Apparatus, system, and method for designing via pads having extended contoursNVIDIA CORP·Filed 2004·Granted Apr 1, 2008·6 cites·5 claims
- 1146US2016379939A1Removable substrate for controlling warpage of an integrated circuit packageNVIDIA CORP·Filed 2016·Application pending·0 cites
- 1242US8698305B1Multi-configuration GPU interface deviceDEWEY THOMAS E·Filed 2004·Granted Apr 15, 2014·1 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →