Inventor · disambiguated record
Hideki Tokuyama
Also filed as: TOKUYAMA HIDEKI
4 granted patents·2 pending applications·159 citations·filing 2001–2008
78Inventor score
Top patents by PatentIndex Score
6 records- 0193US6922686B2Database integration management method and apparatus and processing program, medium thereforHITACHI LTD·Filed 2001·Granted Jul 26, 2005·121 cites·11 claims
- 0269US7056770B2Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin materialFUJITSU LTD·Filed 2003·Granted Jun 6, 2006·19 cites·9 claims
- 0368US7173515B2RFID tag, and RFID tag-related determining device and method, and management system and methodHITACHI LTD·Filed 2003·Granted Feb 6, 2007·19 cites·19 claims
- 0442US2009102093A1Method of sealing and molding electronic component with resin and moldTOKUYAMA HIDEKI·Filed 2008·Application pending·0 cites
- 0535US7333972B2Database integration management method and apparatus and processing program, medium thereforHITACHI LTD·Filed 2005·Granted Feb 19, 2008·0 cites·10 claims
- 0626US2004002977A1Method and system for veryfing a deedFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →