Method of sealing and molding electronic component with resin and mold

Abstract

A molded product (consisting of resin compact and substrate) is formed by sealing and molding an electronic component mounted on a substrate in a resin compact by injecting/charging a heated/molten resin material into a cavity. Then, when a pressing member presses an ejector plate urged in a return direction (downward) in an ejective direction (upward) through a presser, a return pin guides mold releasing pins fixedly provided on the ejector plate, thereby ejecting and releasing the molded product from a mold with the mold releasing pins. Upon defective sliding of the mold releasing pins, the mold releasing pins can be returned to return positions by pressing the return pin with an upper mold section.

1 . A method of sealing and molding an electronic component with resin for forming a molded product by sealing and molding an electronic component mounted on a substrate with a mold for sealing and molding an electronic component with resin consisting of a first mold section, a second mold section and an intermediate mold section provided between said first and second mold sections by injecting and charging a heated and molten resin material into a cavity for resin molding provided in said intermediate mold section, comprising the steps of:
 ejecting and releasing necessary portions of said molded product from said mold with a necessary number of mold releasing pins fixedly set on an ejector plate provided on said intermediate mold section and pressed toward said second mold section by pressing said ejector plate with a pressing member provided on said second mold section through a presser provided on said intermediate mold section in molding with said mold;   elastically pressing said ejector plate and returning said ejector plate to a return position by canceling the pressing with said pressing member in molding with said mold; and   guiding said mold releasing pins in a protrusive or returned direction with a return pin fixedly provided on said ejector plate in molding with said mold.   
   
   
       2 . The method of sealing and molding an electronic component with resin according to  claim 1 , further comprising the step of returning said mold releasing pins to return positions by pressing said return pin with said first mold section upon defective sliding of said mold releasing pins. 
   
   
       3 . A mold for sealing and molding an electronic component with resin including a first mold section, a second mold section opposed to said first mold section, an intermediate mold section provided between said first and second mold sections and a cavity for resin molding provided on a mold surface of said intermediate mold section closer to said first mold section, comprising:
 an ejector plate provided at said intermediate mold section;   a necessary number of mold releasing pins fixedly provided at said ejector plate;   a presser provided at said intermediate mold section for pressing said ejector plate in an ejective direction;   a pressing member provided at said second mold section for pressing said ejector plate through said presser;   an elastic member returning said mold releasing pins to return positions;   another elastic member returning said ejector plate to a return position; and   a return pin guiding said ejector plate and said mold releasing pins in a protrusive or returned direction.