Inventor · disambiguated record
Chien-Kuang Lai
Also filed as: LAI CHIEN-KUANG
2 granted patents·4 pending applications·13 citations·filing 2012–2025
57Inventor score
Top patents by PatentIndex Score
6 records- 0176US9024203B2Embedded printed circuit board and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted May 5, 2015·6 cites·10 claims
- 0276US8610250B2Packaging substrate having embedded capacitors and fabrication method thereofLAI CHIEN-KUANG·Filed 2012·Granted Dec 17, 2013·7 cites·9 claims
- 0352US2024096721A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 0446US2014076492A1Fabrication method of packaging substrate having embedded capacitorsUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 0544US2025308937A1Manufacturing method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0621US2012314377A1Packaging structure embedded with electronic elements and method of fabricating the sameLAI CHIEN-KUANG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →