Inventor · disambiguated record
Gyu-Hwan Kwag
Also filed as: KWAG GYU-HWAN
14 granted patents·4 pending applications·1,209 citations·filing 1997–2009
95Inventor score
Top patents by PatentIndex Score
18 records- 0197US6503365B1Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jan 7, 2003·569 cites·30 claims
- 0291US6402849B2Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jun 11, 2002·105 cites·20 claims
- 0391US5900163AMethods for performing plasma etching operations on microelectronic structuresSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted May 4, 1999·192 cites·26 claims
- 0486US6232228B1Method of manufacturing semiconductor devices, etching composition for manufacturing semiconductor devices, and semiconductor devices made using the methodSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted May 15, 2001·77 cites·28 claims
- 0582US6930050B2Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 16, 2005·19 cites·44 claims
- 0678US6436809B1Method of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices made using this methodSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Aug 20, 2002·19 cites·13 claims
- 0774US6460269B2Wafer dryer comprising revolving spray nozzle and method for drying wafers using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Oct 8, 2002·19 cites·31 claims
- 0874US6200414B1Circulation system for supplying chemical for manufacturing semiconductor devices and circulating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Mar 13, 2001·49 cites·11 claims
- 0974US6197150B1Apparatus for wafer treatment for the manufacture of semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Mar 6, 2001·44 cites·19 claims
- 1071US6235147B1Wet-etching facility for manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted May 22, 2001·40 cites·19 claims
- 1169US6140233AMethod of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices therebySAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Oct 31, 2000·32 cites·32 claims
- 1268US6113754ASputtering apparatus having a target backing plate equipped with a cooling line and sputtering method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Sep 5, 2000·35 cites·12 claims
- 1366US7776226B2Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 17, 2010·1 cites·4 claims
- 1459US6732750B2Semiconductor wafer cleaning apparatus and method of using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 11, 2004·8 cites·11 claims
- 1558US2009203211A1Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1647US2005236092A1Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturingKIM KI-SANG·Filed 2005·Application pending·0 cites
- 1743US2006026857A1Multi-chambers system having compact installation set-up for an etching facility for semiconductor device manufacturingKIM KI-SANG·Filed 2005·Application pending·0 cites
- 1838US2001006246A1Method of manufacturing semiconductor devices, etching composition for manufacturing semiconductor devices, and semiconductor devices made using the methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →