Inventor · disambiguated record
Jui-Meng Jao
Also filed as: JAO JUI-MENG
17 granted patents·5 pending applications·361 citations·filing 1999–2009
94Inventor score
Files withUNITED MICROELECTRONICS CORP11SILICONWARE PRECISION INDUSTRIES CO LTD6JAO JUI-MENG2LIN ZONG-HUEI1SILICONWARE PREC IND1
Top patents by PatentIndex Score
22 records- 0195US7387950B1Method for forming a metal structureUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jun 17, 2008·31 cites·10 claims
- 0292US7256475B2On-chip test circuit for assessing chip integrityUNITED MICROELECTRONICS CORP·Filed 2005·Granted Aug 14, 2007·24 cites·8 claims
- 0392US6265763B1Multi-chip integrated circuit package structure for central pad chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jul 24, 2001·87 cites·8 claims
- 0491US6415974B2Structure of solder bumps with improved coplanarity and method of forming solder bumps with improved coplanaritySILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jul 9, 2002·77 cites·11 claims
- 0582US6348401B1Method of fabricating solder bumps with high coplanarity for flip-chip applicationSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Feb 19, 2002·38 cites·9 claims
- 0680US7176555B1Flip chip package with reduced thermal stressUNITED MICROELECTRONICS CORP·Filed 2005·Granted Feb 13, 2007·9 cites·11 claims
- 0777US7649268B2Semiconductor waferUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jan 19, 2010·4 cites·10 claims
- 0877US6306682B1Method of fabricating a ball grid array integrated circuit package having an encapsulating bodySILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Oct 23, 2001·26 cites·14 claims
- 0976US7518211B2Chip and package structureUNITED MICROELECTRONICS CORP·Filed 2005·Granted Apr 14, 2009·7 cites·17 claims
- 1069US8022509B2Crack stopping structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 20, 2011·4 cites·9 claims
- 1167US7026234B2Parasitic capacitance-preventing dummy solder bump structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2004·Granted Apr 11, 2006·14 cites·17 claims
- 1265US6249433B1Heat-dissipating device for integrated circuit packageSILICONWARE PREC IND·Filed 1999·Granted Jun 19, 2001·31 cites·19 claims
- 1359US7268440B2Fabrication of semiconductor integrated circuit chipsUNITED MICROELECTRONICS CORP·Filed 2005·Granted Sep 11, 2007·2 cites·4 claims
- 1456US6391758B1Method of forming solder areas over a lead frameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 21, 2002·7 cites·5 claims
- 1555US7696606B2Metal structureUNITED MICROELECTRONICS CORP·Filed 2007·Granted Apr 13, 2010·0 cites·14 claims
- 1645US8357988B2Die seal ringUNITED MICROELECTRONICS CORP·Filed 2009·Granted Jan 22, 2013·0 cites·18 claims
- 1743US7250670B2Semiconductor structure and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 31, 2007·0 cites·19 claims
- 1843US2007290204A1Semiconductor structure and method for manufacturing thereofJAO JUI-MENG·Filed 2006·Application pending·0 cites
- 1940US2007069330A1Fuse structure for a semiconductor deviceJAO JUI-MENG·Filed 2005·Application pending·0 cites
- 2039US2005110120A1Scribe line structure of waferFiled 2003·Application pending·0 cites
- 2137US2006278957A1Fabrication of semiconductor integrated circuit chipsLIN ZONG-HUEI·Filed 2005·Application pending·0 cites
- 2236US2002033527A1Semiconductor device and manufacturing process thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →