Assignee
SILICONWARE PREC IND
US·2 granted patents·2 pending applications·44 citations·filing 1999–2003
Top patents by PatentIndex Score
4 records- 0165US6249433B1Heat-dissipating device for integrated circuit packageSILICONWARE PREC IND·Filed 1999·Granted Jun 19, 2001·31 cites·19 claims
- 0253US6492828B2System and method for detecting bonding status of bonding wire of semiconductor packageSILICONWARE PREC IND·Filed 2001·Granted Dec 10, 2002·13 cites·15 claims
- 0337US2005035444A1Multi-chip package device with heat sink and fabrication method thereofSILICONWARE PREC IND·Filed 2003·Application pending·0 cites
- 0425US2003029901A1System and method for detecting bonding status of bonding wire of semiconductor packageSILICONWARE PREC IND·Filed 2002·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →