Inventor · disambiguated record
Gretchen Adema
Also filed as: ADEMA GRETCHEN · ADEMA GRETCHEN M · ADEMA GRETCHEN MAERKER
10 granted patents·2 pending applications·735 citations·filing 1988–2020
92Inventor score
Files withMCNC5INFINEON TECHNOLOGIES AG2UNITIVE INT LTD2BOC GROUP INC1INFINEON TECHNOLOGIES AMERICAS CORP1
Top patents by PatentIndex Score
12 records- 0196US5767010ASolder bump fabrication methods and structure including a titanium barrier layerMCNC·Filed 1996·Granted Jun 16, 1998·322 cites·35 claims
- 0295US5638469AMicroelectronic module having optical and electrical interconnectsMCNC·Filed 1993·Granted Jun 10, 1997·161 cites·50 claims
- 0389US6222279B1Solder bump fabrication methods and structures including a titanium barrier layerMCNC·Filed 1998·Granted Apr 24, 2001·103 cites·7 claims
- 0487US5237434AMicroelectronic module having optical and electrical interconnectsMCNC·Filed 1991·Granted Aug 17, 1993·75 cites·27 claims
- 0581US7839000B2Solder structures including barrier layers with nickel and/or copperUNITIVE INT LTD·Filed 2009·Granted Nov 23, 2010·11 cites·18 claims
- 0680US7547623B2Methods of forming lead free solder bumpsUNITIVE INT LTD·Filed 2005·Granted Jun 16, 2009·11 cites·28 claims
- 0775US5923796AMicroelectronic module having optical and electrical interconnectsMCNC·Filed 1997·Granted Jul 13, 1999·35 cites·19 claims
- 0867US10741402B2Electronic device, electronic module and methods for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 11, 2020·1 cites·13 claims
- 0963US11615963B2Electronic device, electronic module and methods for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 28, 2023·0 cites·20 claims
- 1054US4897287AMetallization process for an integrated circuitBOC GROUP INC·Filed 1988·Granted Jan 30, 1990·16 cites·15 claims
- 1148US2013256894A1Porous Metallic Film as Die Attach and InterconnectINT RECTIFIER CORP·Filed 2012·Application pending·0 cites
- 1247US2017092611A1Porous metallic film as die attach and interconnectINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →