Inventor · disambiguated record
Seunghoon Yeon
Also filed as: YEON SEUNGHOON
16 granted patents·6 pending applications·11 citations·filing 2018–2024
87Inventor score
Files withSAMSUNG ELECTRONICS CO LTD22
Top patents by PatentIndex Score
22 records- 0196US11862596B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 2, 2024·5 cites·20 claims
- 0294US11552037B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·3 cites·20 claims
- 0386US10748953B2Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 18, 2020·2 cites·20 claims
- 0482US11545417B2Integrated circuit device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 3, 2023·1 cites·20 claims
- 0572US11990452B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 21, 2024·0 cites·18 claims
- 0671US11887913B2Integrated circuit device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 0768US11569201B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 0866US11869818B2Chip-stacked semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·12 claims
- 0964US11626385B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 1062US11328966B2Chip-stacked semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 1156US10615213B2Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 7, 2020·0 cites·23 claims
- 1256US2025167144A1Semiconductor structure, semiconductor chip including semiconductor structure and method for manufacturing semiconductor structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1355US2024258224A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1454US11158603B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·18 claims
- 1554US2024243104A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1652US2024096841A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1752US2024170455A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1851US2023035032A1Semiconductor package including bump structures with different shapesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1949US11942446B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·19 claims
- 2048US11545512B2Image sensor package with underfill and image sensor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·18 claims
- 2146US10636760B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·19 claims
- 2245US11244894B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 8, 2022·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →