Inventor · disambiguated record
Younghoon Ro
Also filed as: RO YOUNGHOON
6 granted patents·1 pending application·21 citations·filing 2010–2020
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0184US8143713B2Chip-on-board packageSONG EUN-SEOK·Filed 2010·Granted Mar 27, 2012·9 cites·15 claims
- 0278US8823185B2Semiconductor packagesO IN WON·Filed 2011·Granted Sep 2, 2014·9 cites·19 claims
- 0361US9018041B2Package for semiconductor device including guide rings and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 28, 2015·1 cites·10 claims
- 0460US8587108B2Package for semiconductor device including guide rings and manufacturing method of the sameYOUN HANSHIN·Filed 2011·Granted Nov 19, 2013·2 cites·19 claims
- 0547US9418914B2Package substrates, semiconductor packages having the package substratesRO YOUNGHOON·Filed 2013·Granted Aug 16, 2016·0 cites·21 claims
- 0646US2016322296A1Package substrates, semiconductor packages having the package substrates, and methods for fabricating the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 0740US11373942B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →