Package substrates, semiconductor packages having the package substrates, and methods for fabricating the semiconductor packages

Abstract

Package substrates, semiconductor packages including the package substrates, and methods for fabricating the semiconductor packages are provided. A package substrate may include a core including a first surface on which a semiconductor chip is disposed and a second surface opposite the first surface. The package substrate may also include a metal pad on the second surface of the core. The metal pad may include a saline water corrosion resistant surface.

What is claimed is: 
     
         1 . A method of fabricating a semiconductor package, the method comprising:
 providing a core comprising a first surface and a second surface opposite the first surface;   forming a through hole penetrating through the core;   forming a metal pad on the first surface of the core;   treating a surface of the metal pad to form a saline water corrosion resistant surface;   mounting a semiconductor chip on the second surface of the core and electrically connected to the metal pad; and   forming a molding layer on the second surface of the core encapsulating the semiconductor chip.   
     
     
         2 . A semiconductor package comprising:
 a package substrate comprising a core including a through hole, an aluminum pad on   a first surface of the core, and an anti-corrosion layer on the aluminum pad;   a semiconductor chip on a second surface of the core opposite the first surface of the core and electrically connected to the aluminum pad by a bonding wire, the bonding wire passing through the through hole; and   a molding layer encapsulating the semiconductor chip, wherein the anti-corrosion layer has a corrosion resistance to saline water.