Inventor · disambiguated record
Sebastian T. M. Soon
Also filed as: SOON SEBASTIAN T M
3 granted patents·68 citations·filing 2004–2008
65Inventor score
Technology areasH10W
Files withSTATS CHIPPAC LTD3
Top patents by PatentIndex Score
3 records- 0191US6943057B1Multichip module package and fabrication methodSTATS CHIPPAC LTD·Filed 2004·Granted Sep 13, 2005·68 cites·16 claims
- 0252US7928564B2Multichip module package and fabrication methodSTATS CHIPPAC LTD·Filed 2008·Granted Apr 19, 2011·0 cites·9 claims
- 0347US7445955B2Multichip module package and fabrication methodSTATS CHIPPAC LTD·Filed 2005·Granted Nov 4, 2008·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Sebastian T. M. Soon files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →