Inventor · disambiguated record
Jea-Eun Lee
Also filed as: LEE JEA-EUN
7 granted patents·2 pending applications·26 citations·filing 2007–2020
79Inventor score
Top patents by PatentIndex Score
9 records- 0189US9082464B2Memory module for high-speed operationsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 14, 2015·14 cites·20 claims
- 0264US8559241B2Data receiver, semiconductor device and memory device including the samePARK SUNG-JOO·Filed 2011·Granted Oct 15, 2013·3 cites·20 claims
- 0359US10887980B2Coupled via structure, circuit board having the coupled via structure and method of manufacturing the circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 5, 2021·0 cites·20 claims
- 0458US7859879B2Memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 28, 2010·4 cites·15 claims
- 0557US7540743B2Memory module, memory module socket and mainboard using sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 2, 2009·5 cites·10 claims
- 0655US2009209134A1Memory module, memory module socket and mainboard using sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0752US10561013B2Coupled via structure, circuit board having the coupled via structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 11, 2020·0 cites·15 claims
- 0849US7799605B2Integrated circuit module and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 21, 2010·0 cites·19 claims
- 0945US2008030943A1Memory module having improved arrangement of discrete devicesKIM KYOUNG-SUN·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →