US2009209134A1PendingUtilityA1

Memory module, memory module socket and mainboard using same

Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Aug 11, 2006Filed: Apr 23, 2009Published: Aug 20, 2009
Est. expiryAug 11, 2026(~0 yrs left)· nominal 20-yr term from priority
H05K 1/0295H01R 13/62988H05K 2201/10159H01R 13/631H05K 1/117H01R 12/83H05K 2201/09954H01R 33/76
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Claims

Abstract

A memory module socket disposed on a principal surface of a mainboard, and adapted to mechanically receive and electrically connect a memory module with a mainboard, the memory module socket including a first unit socket having a plurality of first socket pins adapted to electrically connect a first connector disposed on an edge of the memory module, and a second unit socket having a plurality of second socket pins adapted to electrically connect to a second connector disposed on the memory module orthogonal to the first connector, wherein the memory module as installed in the memory module socket is parallel to the principal surface of the mainboard.

Claims

exact text as granted — not AI-modified
1 . A memory module comprising:
 a memory module substrate having a plurality of memory devices mounted thereon;   a first connector having a first set of connection pins within a first arrangement, the first connector being formed on a lengthwise edge of the memory module substrate; and   a second connector disposed orthogonal to the first connector and having a second set of connection pins with a second arrangement different from the first arrangement.   
   
   
       2 . The memory module of  claim 1 , wherein the first set of connection pins has a linear side-by-side arrangement and the plurality set of connection pins has a complex arrangement. 
   
   
       3 . The memory module of  claim 2 , wherein the complex arrangement comprises a staggered or zigzag arrangement. 
   
   
       4 . The memory module of  claim 1 , wherein the second connector comprises two second connectors respectively formed on opposing widthwise edges of the memory module. 
   
   
       5 . The memory module of  claim 1 , wherein the second connector is a single connector centrally disposed in the memory module. 
   
   
       6 . The memory module of  claim 1 , wherein the memory module is a small outline dual in-line memory module SODIMM.

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