Inventor · disambiguated record
Azhar Aripin
Also filed as: ARIPIN AZHAR · ARIPIN AZHAR BIN
8 granted patents·4 pending applications·128 citations·filing 2002–2020
87Inventor score
Top patents by PatentIndex Score
12 records- 0194US9679878B1Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jun 13, 2017·9 cites·23 claims
- 0292US6885093B2Stacked die semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Apr 26, 2005·80 cites·14 claims
- 0387US7211466B2Stacked die semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 1, 2007·16 cites·8 claims
- 0486US9659837B2Direct bonded copper semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted May 23, 2017·5 cites·9 claims
- 0585US9941257B2Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Apr 10, 2018·3 cites·20 claims
- 0673US7482679B2Leadframe for a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jan 27, 2009·10 cites·19 claims
- 0771US9768091B2Method of forming an electronic package and structureARIPIN AZHAR·Filed 2012·Granted Sep 19, 2017·5 cites·7 claims
- 0862US2020161209A1Direct bonded copper semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 0955US2018211939A1Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Application pending·0 cites
- 1052US10546798B2Direct bonded copper semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jan 28, 2020·0 cites·19 claims
- 1149US2017365518A1Semiconductor packages with sub-terminals and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Application pending·0 cites
- 1244US2016240452A1Semiconductor packages with sub-terminals and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →