Inventor · disambiguated record
Kwon Whan Han
Also filed as: HAN KWON WHAN
19 granted patents·8 pending applications·137 citations·filing 2006–2018
93Inventor score
Top patents by PatentIndex Score
27 records- 0195US7795139B2Method for manufacturing semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 14, 2010·47 cites·18 claims
- 0289US7898834B2Semiconductor chip with chip selection structure and stacked semiconductor package having the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Mar 1, 2011·18 cites·23 claims
- 0389US7691748B2Through-silicon via and method for forming the sameHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Apr 6, 2010·18 cites·6 claims
- 0487US10770445B2Methods of fabricating semiconductor packages including reinforcement top dieSK HYNIX INC·Filed 2018·Granted Sep 8, 2020·5 cites·15 claims
- 0584US7795073B2Method for manufacturing stack package using through-electrodesHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 14, 2010·12 cites·18 claims
- 0683US8922000B2Chip carriers, semiconductor devices including the same, semiconductor packages including the same, and methods of fabricating the sameHAN KWON WHAN·Filed 2012·Granted Dec 30, 2014·7 cites·19 claims
- 0781US7446405B2Wafer level chip scale package (WLCSP) with high reliability against thermal stressHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Nov 4, 2008·9 cites·5 claims
- 0873US8399355B2Stacked semiconductor package and method for manufacturing the sameHAN KWON WHAN·Filed 2010·Granted Mar 19, 2013·3 cites·10 claims
- 0972US9099456B2Package of electronic device including connecting bump, system including the same and method for fabricating the sameHAN KWON WHAN·Filed 2012·Granted Aug 4, 2015·3 cites·26 claims
- 1071US7834463B2Stack package having pattern die redistributionHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Nov 16, 2010·5 cites·6 claims
- 1168US7705457B2Wafer level semiconductor package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Apr 27, 2010·4 cites·18 claims
- 1264US7468550B2High-performance semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Dec 23, 2008·2 cites·13 claims
- 1363US8586983B2Semiconductor chip embedded with a test circuitHAN KWON WHAN·Filed 2010·Granted Nov 19, 2013·1 cites·15 claims
- 1459US7880311B2Stacked semiconductor package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Feb 1, 2011·1 cites·10 claims
- 1559US7595268B2Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 29, 2009·1 cites·10 claims
- 1658US7859102B2Multi-layer stacked wafer level semiconductor package moduleHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Dec 28, 2010·1 cites·13 claims
- 1751US2013078807A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the sameSK HYNIX INC·Filed 2012·Application pending·0 cites
- 1851US2009189281A1semiconductor package and a method for manufacturing the sameHAN KWON WHAN·Filed 2009·Application pending·0 cites
- 1950US2009184414A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the samePARK CHANG JUN·Filed 2008·Application pending·0 cites
- 2049US8338921B2Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the samePARK CHANG JUN·Filed 2011·Granted Dec 25, 2012·0 cites·3 claims
- 2144US2010148370A1Through-silicon via and method for forming the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 2241US8836054B2Semiconductor chip capable of improving mounting reliability and semiconductor package having the sameHAN KWON WHAN·Filed 2011·Granted Sep 16, 2014·0 cites·8 claims
- 2340US8441098B2Semiconductor packageHAN KWON WHAN·Filed 2010·Granted May 14, 2013·0 cites·19 claims
- 2440US2014014958A1Semiconductor chip module and semiconductor package having the sameSK HYNIX INC·Filed 2013·Application pending·0 cites
- 2538US2011272692A1Size variable type semiconductor chip and semiconductor package using the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 2638US2013099235A1Semiconductor wafer and method for manufacturing stack package using the sameHAN KWON WHAN·Filed 2012·Application pending·0 cites
- 2738US2011309358A1Semiconductor chip with fine pitch leads for normal testing of sameKIM JONG HOON·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →