semiconductor package and a method for manufacturing the same

Abstract

A semiconductor package and a method for manufacturing the same capable of supplying power easily without an increase in the number of pads for power supply. The semiconductor package includes a semiconductor chip having a plurality of pads including pads for power supply disposed in a center portion and an internal wiring disposed to be exposed to outside; an insulating film formed on the semiconductor to expose the pads for power supply and the internal wirings; and re-distribution lines formed on the insulating film to connect between the exposed portions of the pads for power supply and the internal wiring.

1 . A semiconductor package comprising:
 a semiconductor chip having a plurality of pads including pads for power supply disposed in a center portion and an internal wiring exposed to the outside of the semiconductor chip;   an insulating film formed on the semiconductor chip to expose the pads for power supply and the internal wirings; and   re-distribution lines formed on the insulating film to connect the exposed portions of the pads for power supply and the exposed internal wiring.   
   
   
       2 . The semiconductor package according to  claim 1 , wherein the number of the pads for power supply is at least two and the exposed internal wirings is at least one. 
   
   
       3 . The semiconductor package according to  claim 2 , wherein the exposed internal wirings and the re-distribution lines of at least one are all connected with each other. 
   
   
       4 . The semiconductor package according to  claim 1 , wherein the re-distribution line is composed of a metal film. 
   
   
       5 . The semiconductor package according to  claim 4 , wherein the metal film is formed with a film of Au or any one alloy film of Cu/Ni/Au, Cu/Au and Ni/Au with Au formed thereon. 
   
   
       6 . The semiconductor package according to  claim 1 , further comprising a capping film formed on the insulating film to expose one portion of the re-distribution line and to expose the pads for power supply.