Inventor · disambiguated record
Friedrich Paul Lindner
Also filed as: LINDNER FRIEDRICH · LINDNER FRIEDRICH PAUL
57 granted patents·7 pending applications·569 citations·filing 1977–2024
98Inventor score
Files withEV GROUP E THALLNER GMBH29DEUTSCHE FORSCH LUFT RAUMFAHRT13EV GROUP GMBH8LINDNER FRIEDRICH PAUL5DIEHL GMBH & CO3
Top patents by PatentIndex Score
64 records- 0197US4211208AContainer for a heat storage mediumDEUTSCHE FORSCH LUFT RAUMFAHRT·Filed 1977·Granted Jul 8, 1980·109 cites·11 claims
- 0296US5269145AHeat storage system with combined heat storage deviceDEUTSCHE FORSCH LUFT RAUMFAHRT·Filed 1992·Granted Dec 14, 1993·137 cites·24 claims
- 0393US10279575B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2013·Granted May 7, 2019·9 cites·9 claims
- 0492US9381732B2Device for stripping a product substrate from a carrier substrateEV GROUP GMBH·Filed 2014·Granted Jul 5, 2016·9 cites·4 claims
- 0589US10438822B2Method for prefixing of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Oct 8, 2019·3 cites·9 claims
- 0687US11059280B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jul 13, 2021·2 cites·7 claims
- 0786US9666470B2Receptacle device, device and method for handling substrate stacksEV GROUP E THALLNER GMBH·Filed 2013·Granted May 30, 2017·5 cites·20 claims
- 0885US8449716B2Device and method for separating a substrate from a carrier substrateWIMPLINGER MARKUS·Filed 2010·Granted May 28, 2013·6 cites·7 claims
- 0985US2023294390A1Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2023·Application pending·0 cites
- 1083US10971378B2Method and device for bonding substratesEV GROUP E THALLNER GMBH·Filed 2018·Granted Apr 6, 2021·2 cites·7 claims
- 1181US8918989B2Device for aligning and pre-fixing a waferBURGGRAF JÜRGEN·Filed 2010·Granted Dec 30, 2014·6 cites·8 claims
- 1281US5046553AHeat pipeDEUTSCHE FORSCH LUFT RAUMFAHRT·Filed 1990·Granted Sep 10, 1991·46 cites·12 claims
- 1380US10014193B2Method and device for bonding substratesEV GROUP E THALLNER GMBH·Filed 2014·Granted Jul 3, 2018·3 cites·21 claims
- 1479US12062521B2Method for prefixing of substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Aug 13, 2024·0 cites·3 claims
- 1579US11328939B2Method for prefixing of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted May 10, 2022·1 cites·18 claims
- 1679US10239253B2Method for embossing of substratesEV GROUP E THALLNER GMBH·Filed 2015·Granted Mar 26, 2019·2 cites·13 claims
- 1779US8894807B2Device and method for detaching a semiconductor wafer from a substrateLINDNER FRIEDRICH PAUL·Filed 2010·Granted Nov 25, 2014·3 cites·13 claims
- 1878US11697281B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Jul 11, 2023·0 cites·10 claims
- 1977US9272501B2Device for detaching a product substrate off a carrier substrateBURGGRAF JÜRGEN·Filed 2011·Granted Mar 1, 2016·3 cites·20 claims
- 2075US4461153AMethod and apparatus for inoculating crystallization seeds into a liquid latent heat storage substanceDEUTSCHE FORSCH LUFT RAUMFAHRT·Filed 1981·Granted Jul 24, 1984·32 cites·2 claims
- 2175US4086958AHeat exchange method and apparatus including two non-mixable mediaDEUTSCHE FORSCH LUFT RAUMFAHRT·Filed 1977·Granted May 2, 1978·36 cites·9 claims
- 2274US9941149B2Receptacle device, device and method for handling substrate stacksEV GROUP E THALLNER GMBH·Filed 2017·Granted Apr 10, 2018·1 cites·5 claims
- 2372US10340161B2Device for prefixing of substratesEV GROUP E THALLNER GMBH·Filed 2014·Granted Jul 2, 2019·1 cites·3 claims
- 2472US9116424B2Device for embossing of substratesLINDNER FRIEDRICH PAUL·Filed 2010·Granted Aug 25, 2015·2 cites·12 claims
- 2570US5101091AArrangement for the guidance of a beam during the treatment of a workpiece with a laserDIEHL GMBH & CO·Filed 1990·Granted Mar 31, 1992·29 cites·5 claims
- 2669US11020950B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·2 claims
- 2769US11020951B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·7 claims
- 2869US11020953B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·7 claims
- 2969US11020952B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·8 claims
- 3067US4587902ASubordinate-ammunition member with target-detecting arrangementDIEHL GMBH & CO·Filed 1984·Granted May 13, 1986·19 cites·7 claims
- 3167US4300622ADischarging a latent-heat accumulatorDEUTSCHE FORSCH LUFT RAUMFAHRT·Filed 1979·Granted Nov 17, 1981·18 cites·10 claims
- 3267US2023001723A1Device and method for embossing micro- and/or nanostructuresEV GROUP E THALLNER GMBH·Filed 2022·Application pending·0 cites
- 3366US9138978B2Device for separating a substrate from a carrier substrateEV GROUP GMBH·Filed 2013·Granted Sep 22, 2015·1 cites·8 claims
- 3466US2021183666A1Method and device for bonding substratesEV GROUP E THALLNER GMBH·Filed 2021·Application pending·0 cites
- 3564US2024355582A1Method for prefixing of substratesEV GROUP E THALLNER GMBH·Filed 2024·Application pending·0 cites
- 3661US11472212B2Device and method for embossing micro- and/or nanostructuresEV GROUP E THALLNER GMBH·Filed 2016·Granted Oct 18, 2022·0 cites·44 claims
- 3761US9186877B2Method for stripping a product substrate from a carrier substrateEV GROUP GMBH·Filed 2014·Granted Nov 17, 2015·0 cites·18 claims
- 3859US10347523B2Receptacle device, device and method for handling substrate stacksEV GROUP E THALLNER GMBH·Filed 2018·Granted Jul 9, 2019·0 cites·15 claims
- 3958US8986496B2Device and method for stripping a product substrate from a carrier substrateEV GROUP GMBH·Filed 2013·Granted Mar 24, 2015·0 cites·6 claims
- 4058US8763239B2System for uniform structuring of substratesLINDNER FRIEDRICH PAUL·Filed 2008·Granted Jul 1, 2014·2 cites·20 claims
- 4156US9381729B2Device for detaching a product substrate off a carrier substrateEV GROUP GMBH·Filed 2013·Granted Jul 5, 2016·0 cites·7 claims
- 4256US4371029ALatent heat accumulatorDEUTSCHE FORSCH LUFT RAUMFAHRT·Filed 1981·Granted Feb 1, 1983·18 cites·9 claims
- 4354US9449863B2Device for aligning and pre-fixing a waferEV GROUP GMBH·Filed 2014·Granted Sep 20, 2016·0 cites·10 claims
- 4453US9457552B2Method for detaching a product substrate off a carrier substrateEV GROUP GMBH·Filed 2015·Granted Oct 4, 2016·0 cites·42 claims
- 4553US4286650AMethod for charging or discharging a heat accumulatorDEUTSCHE FORSCH LUFT RAUMFAHRT·Filed 1979·Granted Sep 1, 1981·12 cites·5 claims
- 4651US12283491B2Method for producing singulated encapsulated componentsEV GROUP E THALLNER GMBH·Filed 2019·Granted Apr 22, 2025·0 cites·7 claims
- 4750US4444110AArrangement for generating a firing signal for overflight-flying bodiesDIEHL GMBH & CO·Filed 1982·Granted Apr 24, 1984·12 cites·4 claims
- 4849US9653329B2Semiconductor treating device and methodEV GROUP E THALLNER GMBH·Filed 2013·Granted May 16, 2017·0 cites·5 claims
- 4949US2024387270A1Method and device for producing and preparing electronic componentsEV GROUP E THALLNER GMBH·Filed 2021·Application pending·0 cites
- 5048US12199062B2Device and method for the alignment of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Jan 14, 2025·0 cites·20 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →