Device and method for embossing micro- and/or nanostructures

Abstract

An apparatus and a method for embossing micro- and/or nanostructures include the embossing of the micro- and/or nanostructures in an embossing material.

Having described the invention, the following is claimed: 
     
         1 . An apparatus for embossing micro- and/or nanostructures in an embossing material applied on a substrate, the apparatus comprising:
 an embossing module, the module comprising:
 a structural stamp; 
 at least one moveable embossing element configured to act on the structural stamp; and 
 a lamp house configured to track the embossing element. 
   
     
     
         2 . The apparatus according to  claim 1 , wherein the lamp house is further configured to illuminate stepwise or continuously partial segments of the embossing material. 
     
     
         3 . The apparatus according to  claim 1 , further comprising:
 demoulding means for separating the structural stamp from the embossing material when the structural stamp is in contact with the embossing material.   
     
     
         4 . The apparatus according to  claim 3 , wherein the demoulding means are connected to the structural stamp. 
     
     
         5 . The apparatus according to  claim 3 , wherein the demoulding means are connected to the structural stamp through a clamping bar holding one or more of the structural stamp and a support of the structural stamp. 
     
     
         6 . The apparatus according to  claim 1 , further comprising:
 a embossing element suspension system configured to implement a counterforce to adjust a force acting on one or more of the structural stamp and a support of the structural stamp.   
     
     
         7 . The apparatus according to  claim 1 , wherein the structural stamp is fixed by one or more clamping bars, the clamping bars being moveable perpendicularly to a stamping surface and/or in a Z-direction. 
     
     
         8 . The apparatus according to  claim 7 , wherein the clamping bars are moveable along a demoulding curve. 
     
     
         9 . The apparatus according to  claim 1 , wherein the embossing element and the lamp house are moveable parallel to a surface of the substrate at a speed between 1 mm/s and 1000 mm/s. 
     
     
         10 . The apparatus according to  claim 1 , wherein the embossing element and the lamp house are moveable at the same speed. 
     
     
         11 . The apparatus according to  claim 1 , wherein a translatory movement of the embossing element results in a reengagement of the embossing element with the lamp house, and wherein the reengagement of the embossing element with the lamp house takes place either simultaneously with a movement of the embossing element or a time delay. 
     
     
         12 . A method for embossing micro- and/or nanostructures in an embossing material applied on a substrate, the method comprising:
 acting on a structural stamp of an embossing module with at least one moveable embossing element of the embossing module; and   tracking the embossing element with a lamp house of the embossing module.   
     
     
         13 . The method according to  claim 12 , further comprising:
 stepwise or continuously illuminating partial segments of the embossing material with the lamp house.   
     
     
         14 . The method according to  claim 12 , further comprising:
 separating the structural stamp from the embossing material when the structural stamp is in contact with the embossing material   
     
     
         15 . The method according to  claim 14 , wherein the separating comprises effecting a linear movement of a side of the structural stamp. 
     
     
         16 . The method according to  claim 15 , wherein the separating further comprises directing the linear movement normal to a stamping surface stamped by the structural stamp. 
     
     
         17 . The method according to  claim 12 , further comprising:
 implementing, using an embossing element suspension system, a counterforce to adjust a force acting on one or more of the structural stamp and a support of the structural stamp.   
     
     
         18 . The method according to  claim 12 , wherein the embossing element and the lamp house are moveable parallel to a surface of the substrate at a speed between 1 mm/s and 1000 mm/s. 
     
     
         19 . The method according to  claim 12 , wherein the embossing element and the lamp house are moveable at the same speed. 
     
     
         20 . The method according to  claim 12 , wherein a translatory movement of the embossing element results in a reengagement of the embossing element with the lamp house, and wherein the reengagement of the embossing element with the lamp house takes place either simultaneously with a movement of the embossing element or a time delay.