Assignee
EV GROUP GMBH
AT·14 granted patents·1 pending application·11 citations·filing 2013–2018
Top patents by PatentIndex Score
15 records- 0192US9381732B2Device for stripping a product substrate from a carrier substrateEV GROUP GMBH·Filed 2014·Granted Jul 5, 2016·9 cites·4 claims
- 0276US9662846B2Method and device for producing a lens waferEV GROUP GMBH·Filed 2015·Granted May 30, 2017·1 cites·7 claims
- 0370US10279551B2Method for producing a microlensEV GROUP GMBH·Filed 2018·Granted May 7, 2019·0 cites·14 claims
- 0466US10668678B2Die tool, device and method for producing a lens waferEV GROUP GMBH·Filed 2017·Granted Jun 2, 2020·0 cites·17 claims
- 0566US9138978B2Device for separating a substrate from a carrier substrateEV GROUP GMBH·Filed 2013·Granted Sep 22, 2015·1 cites·8 claims
- 0661US9186877B2Method for stripping a product substrate from a carrier substrateEV GROUP GMBH·Filed 2014·Granted Nov 17, 2015·0 cites·18 claims
- 0759US2015231840A1Method and device for producing a microlensEV GROUP GMBH·Filed 2015·Application pending·0 cites
- 0858US8986496B2Device and method for stripping a product substrate from a carrier substrateEV GROUP GMBH·Filed 2013·Granted Mar 24, 2015·0 cites·6 claims
- 0956US9381729B2Device for detaching a product substrate off a carrier substrateEV GROUP GMBH·Filed 2013·Granted Jul 5, 2016·0 cites·7 claims
- 1056US8905111B2Device for releasing an interconnect layer that provides connection between a carrier and a waferEV GROUP GMBH·Filed 2013·Granted Dec 9, 2014·0 cites·18 claims
- 1155US8603294B2Method for stripping a wafer from a carrierEV GROUP GMBH·Filed 2013·Granted Dec 10, 2013·0 cites·9 claims
- 1254US9449863B2Device for aligning and pre-fixing a waferEV GROUP GMBH·Filed 2014·Granted Sep 20, 2016·0 cites·10 claims
- 1353US9457552B2Method for detaching a product substrate off a carrier substrateEV GROUP GMBH·Filed 2015·Granted Oct 4, 2016·0 cites·42 claims
- 1451US9925597B2Chuck adapted for automated couplingEV GROUP GMBH·Filed 2016·Granted Mar 27, 2018·0 cites·18 claims
- 1545US9771223B2Device and method for processing of wafersEV GROUP GMBH·Filed 2013·Granted Sep 26, 2017·0 cites·15 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →