Inventor · disambiguated record
Roland Speckels
Also filed as: SPECKELS ROLAND
12 granted patents·1 pending application·48 citations·filing 2006–2024
88Inventor score
Top patents by PatentIndex Score
13 records- 0180US8835299B2Pre-sintered semiconductor die structureSPECKELS ROLAND·Filed 2012·Granted Sep 16, 2014·10 cites·20 claims
- 0278US7793819B2Apparatus and method for connecting a component with a substrateINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 14, 2010·8 cites·10 claims
- 0378US7525187B2Apparatus and method for connecting componentsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 28, 2009·9 cites·30 claims
- 0477US7555832B2Semiconductor chip attachmentINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 7, 2009·6 cites·24 claims
- 0575US8209858B2Method for mounting electronic components on a supportSPECKELS ROLAND·Filed 2007·Granted Jul 3, 2012·8 cites·10 claims
- 0668US8736052B2Semiconductor device including diffusion soldered layer on sintered silver layerOESCHLER NIELS·Filed 2011·Granted May 27, 2014·4 cites·22 claims
- 0759US8104667B2Method for connecting a component with a substrateGUTH KARSTEN·Filed 2010·Granted Jan 31, 2012·2 cites·20 claims
- 0856US2024413046A1Semiconductor module, power electronic substrate and method for fabricating a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0955US7851334B2Apparatus and method for producing semiconductor modulesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 14, 2010·1 cites·21 claims
- 1048US11676933B2Arrangement and method for joining at least two joining partnersINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
- 1146US10615138B2Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methodsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 7, 2020·0 cites·20 claims
- 1246US8439249B2Device and method for making a semiconductor device including bonding two bonding partnersSPECKELS ROLAND·Filed 2009·Granted May 14, 2013·0 cites·13 claims
- 1330US11081464B2Method for producing an integral join and automatic placement machineINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 3, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →