Assignee
SPECKELS ROLAND
DE·3 granted patents·18 citations·filing 2007–2012
Top patents by PatentIndex Score
3 records- 0180US8835299B2Pre-sintered semiconductor die structureSPECKELS ROLAND·Filed 2012·Granted Sep 16, 2014·10 cites·20 claims
- 0275US8209858B2Method for mounting electronic components on a supportSPECKELS ROLAND·Filed 2007·Granted Jul 3, 2012·8 cites·10 claims
- 0346US8439249B2Device and method for making a semiconductor device including bonding two bonding partnersSPECKELS ROLAND·Filed 2009·Granted May 14, 2013·0 cites·13 claims
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