Inventor · disambiguated record
Glen N. Biggs
Also filed as: BIGGS GLEN N · BIGGS GLEN NELSON
18 granted patents·1 pending application·66 citations·filing 1997–2019
91Inventor score
Top patents by PatentIndex Score
19 records- 0184US9278401B2Fill head interface with combination vacuum pressure chamberIBM·Filed 2013·Granted Mar 8, 2016·5 cites·16 claims
- 0279US10718062B2Prevent and remove organics from reservoir wellsIBM·Filed 2019·Granted Jul 21, 2020·0 cites·12 claims
- 0378US10450667B2System for treating solution for use in electroplating application and method for treating solution for use in electroplating applicationIBM·Filed 2014·Granted Oct 22, 2019·1 cites·14 claims
- 0478US8784618B2Working electrode design for electrochemical processing of electronic componentsARVIN CHARLES L·Filed 2010·Granted Jul 22, 2014·1 cites·9 claims
- 0578US7513410B2Air bearing gap control for injection molded solder headsIBM·Filed 2007·Granted Apr 7, 2009·5 cites·14 claims
- 0676US10895017B2Prevent and remove organics from reservoir wellsIBM·Filed 2018·Granted Jan 19, 2021·0 cites·18 claims
- 0776US10392720B2Prevent and remove organics from reservoir wellsIBM·Filed 2018·Granted Aug 27, 2019·0 cites·12 claims
- 0873US11053604B2System for treating solution for use in electroplating application and method for treating solution for use in electroplating applicationIBM·Filed 2019·Granted Jul 6, 2021·0 cites·15 claims
- 0972US10087546B2Prevent and remove organics from reservoir wellsIBM·Filed 2014·Granted Oct 2, 2018·0 cites·8 claims
- 1072US7401637B2Pressure-only molten metal valving apparatus and methodIBM·Filed 2006·Granted Jul 22, 2008·3 cites·20 claims
- 1169US10053794B2Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solutionGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 21, 2018·0 cites·12 claims
- 1268US9777388B2Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solutionGLOBALFOUNDRIES INC·Filed 2014·Granted Oct 3, 2017·0 cites·11 claims
- 1366US5869139AApparatus and method for plating pin grid array packaging modulesIBM·Filed 1997·Granted Feb 9, 1999·40 cites·8 claims
- 1464US8926820B2Working electrode design for electrochemical processing of electronic componentsARVIN CHARLES L·Filed 2012·Granted Jan 6, 2015·0 cites·6 claims
- 1557US6077405AMethod and apparatus for making electrical contact to a substrate during electroplatingIBM·Filed 1998·Granted Jun 20, 2000·11 cites·17 claims
- 1651US8123088B2Dispensing assembly with a controlled gas environmentBIGGS GLEN NELSON·Filed 2008·Granted Feb 28, 2012·0 cites·24 claims
- 1750US8123089B2Dispensing assembly with an injector controlled gas environmentBIGGS GLEN NELSON·Filed 2008·Granted Feb 28, 2012·0 cites·24 claims
- 1845US6241868B1Method for electroplating a film onto a substrateIBM·Filed 2000·Granted Jun 5, 2001·0 cites·14 claims
- 1945US2009242614A1Method and tool for repositioning solder fill headIBM·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →