Inventor · disambiguated record
Eric J. White
Also filed as: WHITE ERIC J · WHITE ERIC JEFFREY
64 granted patents·2 pending applications·959 citations·filing 1992–2019
99Inventor score
Top patents by PatentIndex Score
66 records- 0197US8956903B2Planar cavity MEMS and related structures, methods of manufacture and design structuresHERRIN RUSSELL T·Filed 2010·Granted Feb 17, 2015·37 cites·22 claims
- 0293US6348076B1Slurry for mechanical polishing (CMP) of metals and use thereofIBM·Filed 1999·Granted Feb 19, 2002·147 cites·26 claims
- 0391US7902629B2Integrated BEOL thin film resistorIBM·Filed 2008·Granted Mar 8, 2011·16 cites·8 claims
- 0491US5508234AMicrocavity structures, fabrication processes, and applications thereofIBM·Filed 1994·Granted Apr 16, 1996·112 cites·19 claims
- 0589US6812193B2Slurry for mechanical polishing (CMP) of metals and use thereofIBM·Filed 2002·Granted Nov 2, 2004·53 cites·29 claims
- 0689US5514832AMicrocavity structures, fabrication processes, and applications thereofIBM·Filed 1995·Granted May 7, 1996·94 cites·12 claims
- 0788US9620371B2Semiconductor structures having low resistance paths throughout a waferIBM·Filed 2015·Granted Apr 11, 2017·3 cites·12 claims
- 0887US7485540B2Integrated BEOL thin film resistorIBM·Filed 2005·Granted Feb 3, 2009·11 cites·14 claims
- 0987US6186873B1Wafer edge cleaningIBM·Filed 2000·Granted Feb 13, 2001·49 cites·14 claims
- 1086US9406472B2Planar cavity MEMS and related structures, methods of manufacture and design structuresDANG DINH·Filed 2010·Granted Aug 2, 2016·2 cites·19 claims
- 1185US9159671B2Copper wire and dielectric with air gapsIBM·Filed 2013·Granted Oct 13, 2015·5 cites·16 claims
- 1285US5665655AProcess for producing crackstops on semiconductor devices and devices containing the crackstopsIBM·Filed 1995·Granted Sep 9, 1997·69 cites·27 claims
- 1383US8093679B2Integrated BEOL thin film resistorCHINTHAKINDI ANIL K·Filed 2011·Granted Jan 10, 2012·5 cites·8 claims
- 1483US5530280AProcess for producing crackstops on semiconductor devices and devices containing the crackstopsIBM·Filed 1995·Granted Jun 25, 1996·58 cites·3 claims
- 1579US9613853B2Copper wire and dielectric with air gapsIBM·Filed 2015·Granted Apr 4, 2017·2 cites·18 claims
- 1678US10177000B2Semiconductor structures having low resistance paths throughout a waferIBM·Filed 2017·Granted Jan 8, 2019·1 cites·13 claims
- 1777US6394638B1Trench isolation for active areas and first level conductorsIBM·Filed 2000·Granted May 28, 2002·19 cites·10 claims
- 1877US5294570AReduction of foreign particulate matter on semiconductor wafersIBM·Filed 1992·Granted Mar 15, 1994·66 cites·15 claims
- 1975US10438803B2Semiconductor structures having low resistance paths throughout a waferIBM·Filed 2015·Granted Oct 8, 2019·1 cites·20 claims
- 2075US7824568B2Solution for forming polishing slurry, polishing slurry and related methodsIBM·Filed 2006·Granted Nov 2, 2010·2 cites·7 claims
- 2175US6251775B1Self-aligned copper silicide formation for improved adhesion/electromigrationIBM·Filed 1999·Granted Jun 26, 2001·46 cites·16 claims
- 2273US8518817B2Method of electrolytic plating and semiconductor device fabricationANDERSON FELIX P·Filed 2010·Granted Aug 27, 2013·3 cites·25 claims
- 2372US10589992B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2018·Granted Mar 17, 2020·0 cites·11 claims
- 2472US10549987B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2018·Granted Feb 4, 2020·0 cites·16 claims
- 2571US10589991B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2018·Granted Mar 17, 2020·0 cites·20 claims
- 2669US10173889B2Planar cavity MEMS and related structures, methods of manufacture and design structuresIBM·Filed 2014·Granted Jan 8, 2019·0 cites·13 claims
- 2768US9087839B2Semiconductor structures with metal linesIBM·Filed 2013·Granted Jul 21, 2015·2 cites·20 claims
- 2868US5734192ATrench isolation for active areas and first level conductorsIBM·Filed 1995·Granted Mar 31, 1998·29 cites·20 claims
- 2967US9230914B2Copper wire and dielectric with air gapsIBM·Filed 2014·Granted Jan 5, 2016·1 cites·15 claims
- 3067US5545921APersonalized area leadframe coining or half etching for reduced mechanical stress at device edgeIBM·Filed 1994·Granted Aug 13, 1996·34 cites·7 claims
- 3167US2019362977A1Semiconductor structures having low resistance paths throughout a waferIBM·Filed 2019·Application pending·0 cites
- 3266US9981842B2Micro-Electro-Mechanical System (MEMS) structures and design structuresIBM·Filed 2016·Granted May 29, 2018·0 cites·20 claims
- 3366US9938137B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2016·Granted Apr 10, 2018·0 cites·18 claims
- 3464US11167980B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2015·Granted Nov 9, 2021·0 cites·13 claims
- 3564US9969613B2Method for forming micro-electro-mechanical system (MEMS) beam structureIBM·Filed 2013·Granted May 15, 2018·0 cites·19 claims
- 3664US8088690B2CMP methodMCDEVITT THOMAS L·Filed 2009·Granted Jan 3, 2012·3 cites·9 claims
- 3763US9312140B2Semiconductor structures having low resistance paths throughout a waferIBM·Filed 2014·Granted Apr 12, 2016·0 cites·12 claims
- 3862US9932222B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2016·Granted Apr 3, 2018·0 cites·18 claims
- 3962US9691623B2Semiconductor structures having low resistance paths throughout a waferIBM·Filed 2016·Granted Jun 27, 2017·0 cites·14 claims
- 4062US7888142B2Copper contamination detection method and system for monitoring copper contaminationIBM·Filed 2007·Granted Feb 15, 2011·1 cites·15 claims
- 4162US6294105B1Chemical mechanical polishing slurry and method for polishing metal/oxide layersIBM·Filed 1997·Granted Sep 25, 2001·22 cites·7 claims
- 4261US9478427B2Semiconductor structures having low resistance paths throughout a waferIBM·Filed 2015·Granted Oct 25, 2016·0 cites·5 claims
- 4361US6822472B1Detection of hard mask remaining on a surface of an insulating layerIBM·Filed 2003·Granted Nov 23, 2004·7 cites·20 claims
- 4459US8734665B2Slurry for chemical-mechanical polishing of copper and use thereofBATES GRAHAM M·Filed 2011·Granted May 27, 2014·1 cites·19 claims
- 4559US6355565B2Chemical-mechanical-polishing slurry and method for polishing metal/oxide layersIBM·Filed 2001·Granted Mar 12, 2002·5 cites·8 claims
- 4658US6340601B1Method for reworking copper metallurgy in semiconductor devicesIBM·Filed 1999·Granted Jan 22, 2002·26 cites·16 claims
- 4757US9269666B2Methods for selective reverse mask planarization and interconnect structures formed therebyGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 23, 2016·0 cites·14 claims
- 4855US8710661B2Methods for selective reverse mask planarization and interconnect structures formed therebyHE ZHONG-XIANG·Filed 2008·Granted Apr 29, 2014·0 cites·26 claims
- 4951US8636917B2Solution for forming polishing slurry, polishing slurry and related methodsCOMEAU JOSEPH K V·Filed 2010·Granted Jan 28, 2014·0 cites·10 claims
- 5050US9708508B2Slurry for chemical-mechanical polishing of metals and use thereofGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 18, 2017·0 cites·16 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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